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ICL130D15MIC is listed in the Inrush Current Limiters (ICL) range at ChipApex. The manufacturer field lists Eaton - Electronics Division. Its product description is ICL 1.3 OHM 20% 9A 16MM. Review the specifications below when checking this part for your BOM.
The ICL130D15MIC is an NTC thermistor from the Eaton ICL series, designed for inrush current limiting. It features a nominal resistance of 1.3 Ohms at 25°C with a tolerance of ±20%. The component has a steady-state current rating of 9 A and operates within a temperature range defined by its B-parameter characteristics. Key electrical parameters include a Beta value of 2650 K and a diameter of 15 mm (0.630 inches). It utilizes I-leads for mounting and is supplied in bulk packaging.
Verify the specific manufacturing date code and lot traceability upon receipt to ensure compliance with project requirements. Confirm that the bulk packaging condition meets storage and handling standards. Cross-reference the datasheet revision number to ensure alignment with the latest design specifications before final integration into production lines.
Select this component when a low initial resistance of 1.3 Ohms is required to minimize voltage drop while limiting surge currents up to 9 A. The 15 mm diameter and I-lead configuration suit through-hole applications where space allows. Ensure the operating environment stays within the specified thermal limits to maintain reliability.
This part belongs to the Eaton ICL family of Negative Temperature Coefficient (NTC) thermistors. These components are specifically engineered to protect electronic circuits from high inrush currents that occur when capacitive loads are charged. The ICL130D15MIC represents a standard size and resistance value within this broad portfolio of passive protection devices.
Direct substitutes must match the 1.3 Ohm resistance, 9 A current rating, and 15 mm diameter. Verify compatibility of lead type and Beta constant (2650 K) for circuit simulation accuracy. Alternative parts from other manufacturers may require re-evaluation of thermal dissipation and physical footprint constraints.
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