ICL151D18MIC

Inrush Current Limiters (ICL) Overview

The ICL151D18MIC is a Negative Temperature Coefficient (NTC) thermistor from the Eaton ICL series, designed as an inrush current limiter. It features a nominal resistance of 15 Ohms at 25°C with a tolerance of ±20%. The component has a steady-state current rating of 5 A and a disc diameter of 19.00 mm (0.748 inches). It utilizes a Beta value of 3100 K for temperature characterization.

Inrush Current Limiters (ICL) Feature Summary

• Provides effective limitation of high inrush currents during power-up sequences
• Utilizes NTC material properties to reduce resistance as temperature increases
• Features leaded construction suitable for through-hole mounting applications

Inrush Current Limiters (ICL) Applications

• Power supply input stages
• Transformer primary circuits
• Capacitor charging protection

Inrush Current Limiters (ICL) Procurement Notes

Verify the specific electrical ratings against the official Eaton datasheet before integration. Confirm that the 5 A steady-state current and 15 Ohm resistance align with the circuit design requirements. Ensure the 19 mm package size fits the physical constraints of the target assembly.

Inrush Current Limiters (ICL) Selection Notes

Select this component when a 15 Ohm initial resistance is required to limit surge current. The 5 A steady-state rating determines the maximum continuous operating current. Consider the 3100 K Beta value for thermal modeling accuracy within the application environment.

Inrush Current Limiters (ICL) Part Context

This part belongs to the Eaton ICL family of inrush current limiters. These components are specialized NTC thermistors engineered specifically for protecting electronic circuits from high initial charging currents. The ICL series offers various resistance and current ratings to suit different power levels.

Inrush Current Limiters (ICL) Replacement Considerations

Cross-reference other ICL series parts with similar resistance and current ratings. Verify compatibility with existing PCB footprints and thermal management strategies before substituting.