ICL7612BCPA

Overview

The ICL7612BCPA is a single-channel, low-power operational amplifier manufactured by Analog Devices Inc./Maxim Integrated. It features a gain-bandwidth product of 44 kHz and a slew rate of 16 mV/us. The input offset voltage is specified at 5 mV, with an input bias current of 50 pA. Operating on a supply voltage range from 1 V to 8 V or 2 V to 16 V, it draws 15 uA of quiescent current. The device offers a common-mode rejection ratio of 60 dB and an input voltage noise density of 100 nV/sqrt Hz. It is housed in an SOIC-8 package and operates within a temperature range of -40 C to +85 C.

Feature Summary

• Low power consumption suitable for battery-operated applications
• High input impedance with low input bias current
• Rail-to-rail output capability for maximum dynamic range

Applications

• Battery-powered sensor interfaces
• Portable instrumentation circuits
• Low-frequency signal conditioning

Procurement Notes

Verify the specific suffix 'BCPA' against official manufacturer documentation to confirm pinout compatibility and electrical tolerances. Ensure the component meets RoHS requirements if applicable to your design constraints. Cross-reference the datasheet revision date to validate parameter accuracy before finalizing procurement specifications.

Selection Notes

Select this component for designs requiring ultra-low power operation with moderate precision. The low input bias current makes it suitable for high-impedance source applications. Verify that the 44 kHz bandwidth aligns with the signal frequency requirements of the target application.

Part Context

This part belongs to the ICL7612 series of low-power operational amplifiers. The series is characterized by its ability to operate from single or dual supplies with minimal current draw. It is designed for applications where power efficiency is critical without sacrificing basic signal integrity.

Replacement Considerations

Check for direct replacements such as the ICL7612ACPA or ICL7612DCPA, ensuring pin compatibility and electrical specification alignment. Verify package type consistency between SOIC-8 and DIP variants if physical footprint changes are permissible.