ICS9FG108DFLF

Overview

The ICS9FG108DFLF is a clock frequency timing generator manufactured by Renesas Electronics Corporation. It features an integrated Phase-Locked Loop (PLL) and supports input from both clock signals and crystals. The device provides nine HCSL outputs with a 1:9 input-to-output ratio, operating at a maximum frequency of 400MHz. It functions within a supply voltage range of 3.135V to 3.465V and operates in temperatures between 0°C and 70°C. Packaged in a 48-BSSOP surface-mount case, it is designed for Intel CPU servers, PCI Express, and SATA applications.

Feature Summary

• Integrated PLL-based clock frequency timing generator
• Supports Crystal or Clock inputs with 1:9 output ratio
• HCSL output signaling up to 400MHz
• Surface mount 48-BSSOP package

Applications

• Intel CPU Server systems
• PCI Express (PCIe) interfaces
• SATA storage controllers

Procurement Notes

Verify the specific suffix 'DFLF' against official Renesas documentation to confirm pinout, marking, or material variations compared to standard variants like EFLFT. Ensure the 48-SSOP package width matches design constraints. Confirm RoHS compliance status through current datasheets before procurement.

Selection Notes

Select this component when a single-input, nine-output HCSL clock distribution solution is required for PCIe or server architectures. Ensure the design accommodates the 3.135V–3.465V supply range and 48-pin SSOP footprint. Verify that the 400MHz maximum frequency meets system timing requirements.

Part Context

This part belongs to the 9FG108 family of clock synthesizers. It shares core specifications with variants such as the 9FG108EFLFT and 9FG108EGLF, differing primarily in packaging or manufacturing lot details indicated by the suffix. It serves as a dedicated timing solution for high-speed serial interface standards.

Replacement Considerations

Direct replacements include the 9FG108EFLFT and 9FG108EGLF, which share identical electrical parameters and pinouts. Verify that the substitute variant's package dimensions and thermal characteristics are compatible with the existing PCB layout.