Memory IC IDT71V3556S166BG product image

IDT71V3556S166BG

  • Description:IC SRAM 4.5MBIT PAR 119PBGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:255657e457ff Category: Brand:

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IDT71V3556S166BG is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 4.5MBIT PAR 119PBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IDT71V3556S166BG

  • Description:IC SRAM 4.5MBIT PAR 119PBGA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, SDR (ZBT)
  • Memory Size:4.5Mbit
  • Memory Organization:128K x 36
  • Memory Interface:Parallel
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3.135V ~ 3.465V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:119-BGA
  • Supplier Device Package:119-PBGA (14x22)
  • Access Time:3.5 ns

Memory IC datasheet and documents for IDT71V3556S166BG

IDT71V3556S166BG

Memory IC Overview

The IDT71V3556S166BG is a 4.5 Megabit synchronous SRAM organized as 128K x 36. It operates with a 3.3V core and I/O supply voltage (3.135V to 3.465V). The device supports a maximum clock frequency of 166 MHz with a 3.5 ns access time. It utilizes Zero Bus Turnaround technology to eliminate dead cycles between read and write operations. The component is housed in a 119-pin PBGA package and supports commercial temperature ranges from 0°C to +70°C.

Memory IC Feature Summary

  • Zero Bus Turnaround architecture eliminates dead bus cycles during read/write transitions
  • Pipelined output buffers provide four-word burst capability for high-speed data transfer
  • Single R/W control pin simplifies interface logic requirements
  • Individual byte write enables allow selective modification of specific data bytes

Memory IC Applications

  • High-performance networking equipment requiring low-latency memory buffering
  • Telecommunications systems utilizing synchronous data processing
  • Industrial automation controllers needing fast random access storage
  • Embedded computing platforms requiring pipelined memory architectures

Memory IC Procurement Notes

Verify the exact suffix 'BG' corresponds to the 119-pin PBGA package configuration before ordering. Confirm that the 'S' designation aligns with the required commercial temperature range specifications. Ensure compatibility with existing 3.3V power delivery networks. Check for RoHS compliance status relative to current manufacturing standards. Validate lead times as this component may be subject to end-of-life restrictions.

Memory IC Selection Notes

Select this model when a 128K x 36 organization is required for wide data bus applications. Choose the 166MHz speed grade for systems demanding higher throughput than lower-frequency variants offer. Consider the PBGA package for board space optimization compared to TQFP options. Evaluate the need for individual byte write capabilities versus full-word writes. Compare against newer Renesas equivalents if long-term supply assurance is critical.

Memory IC Part Context

This component belongs to the IDT 71V3556 family of synchronous ZBT SRAMs manufactured by Integrated Device Technology, now part of Renesas Electronics. The family includes variations with different speeds, organizations (such as 256K x 18), and packages. These devices are designed for high-speed parallel memory interfaces where minimal turnaround latency is essential for system performance.

Memory IC Replacement Considerations

The IDT71V3556SA166BGGI is listed as a similar replacement option within the same manufacturer portfolio.

IDT71V3556S166BGIDT71V3556S166BG

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