IDT74FCT163344CPAG

Universal Bus Functions Overview

The IDT74FCT163344CPAG is a 3.6V CMOS address driver manufactured by Renesas Electronics Corporation. It utilizes 0.5 micron CMOS technology to provide high-speed signal distribution with low power consumption. The device features an output skew of less than 250ps, ensuring precise timing alignment across multiple channels. It is housed in a 56-TSSOP package and supports ESD protection exceeding 2000V per MIL-STD-883 standards.

Universal Bus Functions Feature Summary

• Utilizes advanced 0.5 micron CMOS technology for high-speed operation
• Provides low output skew typically under 250ps
• Offers robust ESD protection exceeding 2000V per MIL-STD-883

Universal Bus Functions Applications

• High-speed clock distribution networks
• Address bus buffering systems
• Multi-channel data routing applications

Universal Bus Functions Procurement Notes

Verify the specific voltage requirements and pinout configuration against the official datasheet before integration. Confirm that the 56-TSSOP package dimensions match your PCB footprint. Ensure that the ESD handling procedures meet the specified MIL-STD-883 standards during assembly and testing phases.

Universal Bus Functions Selection Notes

Select this component when low skew and high-speed performance are critical for address or clock signals. Consider the 3.6V operating voltage range and the 56-pin form factor. Evaluate the trade-off between the advanced CMOS process speed and the specific packaging constraints for your design.

Universal Bus Functions Part Context

This part belongs to the FCT logic family, designed for fast CMOS applications. It serves as a specialized driver within Renesas's portfolio, focusing on signal integrity and speed. The IDT branding indicates its lineage from Integrated Device Technology, now part of Renesas.

Universal Bus Functions Replacement Considerations

Check for direct substitutes within the same FCT series that offer compatible voltage levels and pinouts. Verify if alternative packages provide the same electrical characteristics while fitting different board space requirements.