IM1G16D2DDBG-25

Memory IC Overview

The IM1G16D2DDBG-25 is a DDR2 SDRAM component manufactured by Intelligent Memory. It provides a storage capacity of 1 Gbit organized as 64M x 16 bits with an 800 Mbps data rate at a maximum clock frequency of 400 MHz. The device operates within a voltage range of 1.7 V to 1.9 V and features a 400 ps access time. It is housed in an FBGA-84 package designed for surface mount technology. The operational temperature range extends from 0°C to +95°C, supporting industrial applications requiring reliable memory performance.

Memory IC Feature Summary

• Supports double data rate synchronous dynamic random access memory operations for high-speed data transfer
• Utilizes a compact FBGA-84 surface mount package for efficient board space utilization
• Operates within a wide industrial temperature range suitable for demanding environments

Memory IC Applications

• Industrial control systems requiring robust memory solutions
• Embedded computing platforms needing high-density storage
• Automotive electronics operating under extended temperature conditions

Memory IC Procurement Notes

Verify the specific suffix and package type against official datasheets before ordering. Confirm that the required operating temperature range aligns with the 0°C to +95°C specification. Ensure compatibility with the 1.8V power supply requirements and check for moisture sensitivity handling procedures during assembly.

Memory IC Selection Notes

Select this component when a 1 Gbit density with a 16-bit interface is required. Consider the FBGA-84 footprint constraints and the 400 MHz speed capability. Evaluate the thermal management needs for the +95°C maximum junction temperature limit compared to commercial grade alternatives.

Memory IC Part Context

This part belongs to the Intelligent Memory DDR2 family, offering high-density storage in a small form factor. It serves as a key component for systems requiring reliable volatile memory with fast access times. The series supports various organizational configurations to meet different bandwidth and capacity demands in embedded designs.