IM2508SDBBTG-6

Memory IC Overview

The IM2508SDBBTG-6 is a 256 Mbit Synchronous Dynamic Random Access Memory (SDRAM) manufactured by Intelligent Memory. It features an 8-bit data bus width and operates at a maximum clock frequency of 166 MHz. The memory organization is specified as 32 Megawords by 8 bits. The component supports a supply voltage range from 3 V to 3.6 V. It is housed in a TSOP-II-54 surface-mount package with a typical access time of 5.4 ns. The device is rated for commercial operating temperatures between 0°C and +70°C.

Memory IC Feature Summary

• Supports high-speed synchronous data transfer via standard SDRAM interface protocols
• Provides dense storage capacity within a compact thin small-outline package
• Operates on standard single-voltage power supply requirements

Memory IC Applications

• Embedded systems requiring volatile data storage
• Industrial control units operating in commercial temperature ranges
• Consumer electronics utilizing 3.3V logic interfaces

Memory IC Procurement Notes

Verify the specific suffix codes against official manufacturer documentation to confirm pinout compatibility and electrical characteristics. Ensure that the ordering information matches the required temperature grade and package variant. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and current production status before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a 256 Mbit density with an 8-bit interface is required for space-constrained designs. The TSOP-II-54 package suits applications where through-hole or specific surface mount footprints are mandated. Consider the 166 MHz speed grade relative to system bus requirements and ensure the 3.3V operation aligns with the target platform's power architecture.

Memory IC Part Context

This part belongs to the Intelligent Memory SDRAM portfolio, designed for general-purpose volatile memory applications. The series offers various densities and interface widths to accommodate different system architectures. The TSOP-II form factor provides a balance between pin count and board area efficiency for mid-density memory solutions.

Memory IC Replacement Considerations

Consult official substitution guides for electrically compatible alternatives. Verify pin-to-pin compatibility and timing parameters if replacing with parts from other manufacturers.