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IM2516SDBDBG-6I is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is SDRAM, 256MB, 3.3V, 16MX16, 166M. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IM2516SDBDBG-6I
- Description：SDRAM, 256MB, 3.3V, 16MX16, 166M
- Series：-
- Mfr：Intelligent Memory Ltd.
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM
- Memory Size：256Mbit
- Memory Organization：16M x 16
- Memory Interface：LVTTL
- Clock Frequency：166 MHz
- Write Cycle Time - Word, Page：12ns
- Voltage - Supply：3V ~ 3.6V
- Operating Temperature：-40°C ~ 95°C (TC)
- Mounting Type：Surface Mount
- Package / Case：54-TFBGA
- Supplier Device Package：54-FBGA (8x8)
- Access Time：5 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for IM2516SDBDBG-6I
Memory IC Overview
The IM2516SDBDBG-6I is a 256Mb SDRAM component manufactured by Intelligent Memory. It features a 16M x 16 organization with a 16-bit data bus width and supports clock frequencies up to 166MHz (1666Mbps). The device operates within a voltage range of 3V to 3.6V and includes an access time of 5.4ns. It is housed in an FBGA-54 package and is rated for industrial temperature ranges from -40°C to +85°C.
Memory IC Feature Summary
- Supports high-speed synchronous dynamic random access memory operations at 166MHz.
- Provides 256Mb storage capacity organized as 16M words by 16 bits.
- Designed for industrial applications with extended temperature tolerance.
Memory IC Applications
- Industrial control systems requiring reliable memory storage
- Embedded computing platforms operating in harsh environments
- Automotive electronics modules
Memory IC Procurement Notes
Verify the specific suffix '6I' against official Intelligent Memory documentation to confirm the industrial temperature grade (-40C to +85C) and pinout compatibility. Ensure that the FBGA-54 package dimensions match the target PCB footprint requirements before finalizing procurement decisions.
Memory IC Selection Notes
Select this component when a 256Mb density with a 16-bit interface is required for industrial-grade environments. Compare the 166MHz speed class against system timing constraints. Consider the FBGA-54 package size relative to available board space compared to TSOP alternatives.
Memory IC Part Context
This part belongs to the Intelligent Memory SDRAM family, specifically designed for general-purpose memory applications. It complements other variants in the series that offer different densities or package types, such as TSOP-II configurations, while maintaining consistent electrical characteristics for the 166MHz speed bin.
Memory IC Replacement Considerations
Check for cross-references within the same Intelligent Memory SDRAM portfolio. Verify if alternative packages like TSOP-II-54 are functionally equivalent for the specific design needs.
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