IM2G04D2DBBG-25

Memory IC Overview

The IM2G04D2DBBG-25 is a 2 Gbit DDR2 SDRAM manufactured by Intelligent Memory. It features a 4-bit data bus width and an organization of 512M x 4. The component supports a maximum clock frequency of 400 MHz, equivalent to 800 Mbps data transfer rate. It operates within a voltage range of 1.7 V to 1.9 V and has an access time of 400 ps. The device is housed in an FBGA-60 package and is rated for industrial temperature operation from 0°C to +95°C.

Memory IC Feature Summary

• Supports double data rate 2 (DDR2) synchronous dynamic random-access memory architecture for high-speed data processing.
• Designed for surface-mount technology installation using the compact FBGA-60 package format.
• Operates with low voltage power requirements suitable for energy-efficient electronic systems.

Memory IC Applications

• Embedded memory solutions for industrial control systems
• Data buffering in consumer electronics devices
• Memory expansion for communication equipment

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm exact electrical characteristics and temperature ratings. Ensure compatibility with system voltage levels between 1.7 V and 1.9 V. Confirm package footprint alignment with PCB design requirements for the FBGA-60 configuration prior to integration.

Memory IC Selection Notes

Select this component when a 2 Gbit capacity with a narrow 4-bit interface is required. Consider the 400 MHz operational speed and industrial temperature range for suitability in demanding environments. Evaluate the FBGA-60 package constraints against available board space and routing complexity compared to wider bus alternatives.

Memory IC Part Context

This part belongs to the Intelligent Memory DDR2 SDRAM portfolio, designed for applications requiring moderate density and bandwidth. The series offers various organizational options and package types to accommodate different system architectures. This specific model provides a balance of performance and pin count efficiency for embedded designs.

Memory IC Replacement Considerations

Cross-reference with other Intelligent Memory DDR2 parts sharing the same density and package but differing in bus width or temperature grade. Verify functional equivalence only after confirming detailed datasheet specifications for timing and voltage parameters.