Power Driver Modules IM323L6GXKMA1 product image

IM323L6GXKMA1

$9.63
  • Description:CIPOS TINY 600V 15A THREE-PHASE
  • Series:CIPOS™

SKU:0fc671190ff6 Category: Brand:

  
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IM323L6GXKMA1 is listed in the Power Driver Modules range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is CIPOS TINY 600V 15A THREE-PHASE. Review the specifications below when checking this part for your BOM.

Power Driver Modules specifications for IM323L6GXKMA1

  • Description:CIPOS TINY 600V 15A THREE-PHASE
  • Series:CIPOS™
  • Mfr:Infineon Technologies
  • Package:Tube
  • Type:IGBT
  • Configuration:3 Phase Inverter
  • Current:15 A
  • Voltage:600 V
  • Voltage - Isolation:2000Vrms
  • Mounting Type:Through Hole
  • Package / Case:26-PowerDIP Module (1.043", 26.50mm)
  • Grade:-
  • Qualification:-

Power Driver Modules datasheet and documents for IM323L6GXKMA1

IM323L6GXKMA1

Power Driver Modules Overview

The Infineon IM323-L6G is a CIPOS™ Tiny three-phase intelligent power module featuring 600 V reverse-conducting IGBTs and an integrated SOI gate driver. It supports a continuous collector current of 15 A at 25°C, with a maximum DC link voltage of 450 V. The device includes built-in NTC thermistor monitoring, under-voltage lockout, over-current shutdown, and cross-conduction prevention. Designed for industrial applications, it offers low-side emitter accessibility for phase current sensing.

Power Driver Modules Feature Summary

  • Fully isolated dual in-line molded package with lead-free terminal plating
  • Integrated rugged SOI gate driver technology ensuring stability against transient voltages
  • Built-in NTC thermistor for precise temperature monitoring
  • Low-side emitter pins accessible for individual phase current measurement

Power Driver Modules Applications

  • Air conditioning systems
  • Refrigerator variable speed drives
  • Home appliances
  • Industrial motor drives

Power Driver Modules Procurement Notes

Verify the specific ordering suffix to confirm the exact variant, as the datasheet distinguishes between standard and short-lead versions. Ensure compatibility with the DIP 33x19 package dimensions during PCB layout. Confirm that the application environment meets the industrial qualification standards defined by JEDEC tests before finalizing procurement.

Power Driver Modules Selection Notes

Select this component for designs requiring compact integration of power and control stages. The open-emitter configuration allows for direct current sensing without external isolators. Verify that the controller logic levels are compatible with the LSTTL/CMOS inputs. Ensure the thermal management solution accommodates the specified junction-to-case thermal resistance values.

Power Driver Modules Part Context

This part belongs to the CIPOS™ Tiny IM323 product group, designed to optimize PCB size and system costs. It integrates reverse-conducting IGBTs with optimized gate drivers for excellent electrical performance. The module is qualified for industrial applications according to relevant JEDEC tests, providing robust isolation and protection features.

Power Driver Modules Replacement Considerations

The IM323-L6G2 is listed as a related variant within the same product family. Verify if the specific ordering suffix corresponds to the standard or short-lead version required for the production timeline.

IM323L6GXKMA1IM323L6GXKMA1
$9.63
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