Power Driver Modules IM323S6G2XKMA1 product image

IM323S6G2XKMA1

$5.02
  • Description:CIPOS TINY
  • Series:CIPOS™

SKU:0344a1b0237e Category: Brand:

  
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IM323S6G2XKMA1 is listed in the Power Driver Modules range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is CIPOS TINY. Review the specifications below when checking this part for your BOM.

Power Driver Modules specifications for IM323S6G2XKMA1

  • Description:CIPOS TINY
  • Series:CIPOS™
  • Mfr:Infineon Technologies
  • Package:Tube
  • Type:IGBT
  • Configuration:3 Phase Inverter
  • Current:6:00 AM
  • Voltage:600 V
  • Voltage - Isolation:2000Vrms
  • Mounting Type:Through Hole
  • Package / Case:26-PowerDIP Module (1.043", 26.50mm)
  • Grade:-
  • Qualification:-

Power Driver Modules datasheet and documents for IM323S6G2XKMA1

IM323S6G2XKMA1

Power Driver Modules Overview

The IM323S6G2XKMA1 is a CIPOS™ Tiny intelligent power module featuring a fully isolated dual in-line molded package. It integrates reverse conducting IGBTs with an optimized SOI gate driver for three-phase AC and permanent magnet motor control. The device supports a DC link supply voltage up to 450 V and includes built-in NTC thermistors, undervoltage lockout, overcurrent shutdown, and cross-conduction prevention.

Power Driver Modules Feature Summary

  • Integrates reverse conducting IGBTs with rugged SOI gate driver technology for stability against transients and negative voltages.
  • Includes built-in NTC thermistor for temperature monitoring and low-side emitter pins accessible for phase current sensing.
  • Provides comprehensive protection features including undervoltage lockout, overcurrent shutdown, sleep function, and cross-conduction prevention.

Power Driver Modules Applications

  • Fan and pump drives
  • Small industrial motor drives
  • Home appliance variable speed drives

Power Driver Modules Procurement Notes

Verify the specific ordering suffix XKMA1 against official Infineon documentation to confirm packaging details and compliance status. Confirm that the component meets industrial qualification standards per JEDEC tests. Ensure design compatibility with the specified DIP 33x19 package dimensions and mounting torque requirements before finalizing procurement.

Power Driver Modules Selection Notes

Select this module for applications requiring integrated power and control components to optimize PCB size. It is suitable for designs needing good thermal conduction and electrical isolation. Consider the open-emitter configuration if external phase current monitoring is required. Verify that the system operates within the recommended PWM carrier frequency limits.

Power Driver Modules Part Context

This component belongs to the CIPOS™ Tiny IM323 product group designed for three-phase motor control. It combines power switches with gate drivers to increase reliability and reduce system costs. The package concept is adapted for power applications requiring EMI-safe control and overload protection capabilities.

Power Driver Modules Replacement Considerations

IM323-S6G serves as a standard variant within the same series. Verify pin compatibility and electrical parameters when substituting between S6G and S6G2 variants.

IM323S6G2XKMA1IM323S6G2XKMA1
$5.02
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