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IM323S6G2XKMA1 is listed in the Power Driver Modules range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is CIPOS TINY. Review the specifications below when checking this part for your BOM.
The IM323S6G2XKMA1 is a CIPOS™ Tiny intelligent power module featuring a fully isolated dual in-line molded package. It integrates reverse conducting IGBTs with an optimized SOI gate driver for three-phase AC and permanent magnet motor control. The device supports a DC link supply voltage up to 450 V and includes built-in NTC thermistors, undervoltage lockout, overcurrent shutdown, and cross-conduction prevention.
Verify the specific ordering suffix XKMA1 against official Infineon documentation to confirm packaging details and compliance status. Confirm that the component meets industrial qualification standards per JEDEC tests. Ensure design compatibility with the specified DIP 33x19 package dimensions and mounting torque requirements before finalizing procurement.
Select this module for applications requiring integrated power and control components to optimize PCB size. It is suitable for designs needing good thermal conduction and electrical isolation. Consider the open-emitter configuration if external phase current monitoring is required. Verify that the system operates within the recommended PWM carrier frequency limits.
This component belongs to the CIPOS™ Tiny IM323 product group designed for three-phase motor control. It combines power switches with gate drivers to increase reliability and reduce system costs. The package concept is adapted for power applications requiring EMI-safe control and overload protection capabilities.
IM323-S6G serves as a standard variant within the same series. Verify pin compatibility and electrical parameters when substituting between S6G and S6G2 variants.
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