IM67D130AXTSA1

Microphones Overview

The IM67D130AXTSA1 is a digital MEMS microphone from Infineon's XENSIV™ family, designed for high-fidelity audio capture in automotive and consumer applications. It features an A²B interface for robust digital transmission, supporting advanced noise cancellation and beamforming. The device offers high signal-to-noise ratio and acoustic overload point, ensuring clear audio even in challenging environments with high sound pressure levels.

Microphones Feature Summary

• Digital A²B interface for reliable data transmission
• High signal-to-noise ratio for studio-grade audio quality
• High acoustic overload point for clear audio at maximum SPL
• Supports advanced processing like ANC and beamforming

Microphones Applications

• In-car communication systems
• Driver assistance systems
• Smart conference systems
• Security cameras and video doorbells

Microphones Procurement Notes

Verify the specific suffix XTSA1 against official Infineon documentation to confirm tape-and-reel packaging and orientation. Ensure compatibility with the host processor's A²B interface requirements. Cross-reference the full part number with the latest datasheet revision to avoid ordering errors due to minor package or marking changes.

Microphones Selection Notes

Select this component when a digital MEMS microphone with A²B interface is required for automotive or high-end consumer audio. It is suitable for applications demanding high SNR and robustness against environmental noise. Consider the package dimensions and supply voltage range (1.6V to 3.465V) during PCB layout and power design.

Microphones Part Context

This part belongs to the XENSIV™ MEMS microphone family, which includes various interfaces like PDM and A²B. The IM67D130A variant specifically utilizes the A²B protocol, distinguishing it from PDM-based models like the IM68D128B. It is engineered for precision audio capture in both automotive and consumer electronics sectors.

Microphones Replacement Considerations

Check for direct substitutes within the XENSIV™ family that share the A²B interface and similar package dimensions. Verify if alternative models offer compatible electrical characteristics and pin assignments before substitution.