Memory IC IM8G08D3FFBG-107 product image

IM8G08D3FFBG-107

$19.25
  • Description:DDR3 8GB, 1.35V/1.5V, 1GX8 (1CS)
  • Series:-
  • Mfr:Intelligent Memory Ltd.
  • Package:Tray

SKU:802e38736d91 Category: Brand:

  
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IM8G08D3FFBG-107 is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is DDR3 8GB, 1.35V/1.5V, 1GX8 (1CS). Review the specifications below when checking this part for your BOM.

Memory IC specifications for IM8G08D3FFBG-107

  • Description:DDR3 8GB, 1.35V/1.5V, 1GX8 (1CS)
  • Series:-
  • Mfr:Intelligent Memory Ltd.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:8Gbit
  • Memory Organization:1G x 8
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-FBGA (9x10.6)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IM8G08D3FFBG-107

IM8G08D3FFBG-107

Memory IC Overview

The IM8G08D3FFBG-107 is an 8 Gbit DDR3L SDRAM component manufactured by Intelligent Memory. It features a 1 Gigabit x 8 organization with an 8-bit data bus width. The device supports a maximum clock frequency of 933 MHz, corresponding to a data rate of 1866 Mbps. It operates within a voltage range of 1.283 V to 1.45 V and includes a 20 ns access time. The part is housed in a FBGA-78 package and is rated for industrial temperatures from 0°C to +95°C.

Memory IC Feature Summary

  • Supports low voltage operation at 1.35V or 1.5V for power efficiency
  • Provides high-speed data transfer capabilities up to 1866 Mbps
  • Designed for surface mount technology integration

Memory IC Applications

  • Embedded memory systems requiring compact form factors
  • Industrial control equipment operating in extended temperature ranges
  • Consumer electronics utilizing DDR3L standards

Memory IC Procurement Notes

Verify the specific suffix code against official manufacturer documentation to confirm pinout compatibility and electrical specifications. Ensure that the procurement channel provides valid traceability records for this DRAM component. Confirm RoHS compliance status through current datasheets before finalizing orders. Check for moisture sensitivity level requirements during storage and handling procedures.

Memory IC Selection Notes

Select this component when an 8 Gbit density with an 8-bit interface is required in a small FBGA-78 footprint. Consider the 0°C to +95°C operating range for applications exceeding commercial limits. Evaluate the 1.35V/1.5V dual-voltage capability for system power budget constraints. Compare against other Intelligent Memory DDR3L parts for organizational differences such as 16-bit widths.

Memory IC Part Context

This part belongs to the Intelligent Memory DDR3L series, designed for mobile and embedded applications. It utilizes advanced process technology to achieve high performance within a low-power envelope. The FBGA-78 package allows for dense PCB layouts suitable for space-constrained devices. It serves as a direct replacement for standard DDR3 components where lower voltage operation is beneficial.

Memory IC Replacement Considerations

Cross-reference with IM8G08D3FFDG-107 for identical electrical specs but different package types. Verify pin-to-pin compatibility if substituting with other 8Gx8 DDR3L devices from different manufacturers.

IM8G08D3FFBG-107IM8G08D3FFBG-107
$19.25
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