IM8G08D3FFDG-125I

Memory IC Overview

The IM8G08D3FFDG-125I is an 8 Gbit DDR3L dynamic random-access memory component manufactured by Intelligent Memory. It features a 1 Gigabit x 8 organization with two chip selects and operates at a maximum clock frequency of 933 MHz (1866 Mbps data rate). The device supports dual voltage operation at 1.35 V and 1.5 V, housed in a 78-ball FBGA package. It is rated for an industrial temperature range from -40°C to +95°C.

Memory IC Feature Summary

• Supports low voltage operation at 1.35 V alongside standard 1.5 V supply levels for power efficiency
• Features a compact 78-ball fine-pitch ball grid array package suitable for space-constrained designs
• Includes dual chip select architecture to manage internal bank operations

Memory IC Applications

• Industrial embedded systems requiring wide temperature tolerance
• Automotive infotainment and control modules
• Portable consumer electronics utilizing DDR3L standards

Memory IC Procurement Notes

Verify the specific suffix '125I' against official Intelligent Memory documentation to confirm the exact speed bin and industrial temperature grade. Ensure the design accommodates the 78-ball FBGA footprint and soldering requirements. Confirm that the system controller supports the required 1.35 V/1.5 V dual-voltage signaling levels for proper initialization and operation.

Memory IC Selection Notes

Select this component when an 8 Gbit density is required within a small form factor. The industrial temperature rating makes it suitable for harsh environments where standard commercial parts may fail. Verify that the host platform supports the 1866 Mbps data transfer rate and the specific pinout configuration of the FBGA-78 package before integration.

Memory IC Part Context

This part belongs to the IM8G08D3 series of DDR3L DRAM devices from Intelligent Memory. These components are designed to provide high-density memory solutions with reduced power consumption compared to traditional DDR3 parts. The series targets applications needing reliable performance across varying thermal conditions.