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IM8G16D3FFBG-107 is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is DDR3 8GB, 1.35V/1.5V, 512MX16 (1. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IM8G16D3FFBG-107
- Description：DDR3 8GB, 1.35V/1.5V, 512MX16 (1
- Series：-
- Mfr：Intelligent Memory Ltd.
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - DDR3L
- Memory Size：8Gbit
- Memory Organization：512M x 16
- Memory Interface：Parallel
- Clock Frequency：933 MHz
- Write Cycle Time - Word, Page：15ns
- Voltage - Supply：1.283V ~ 1.45V
- Operating Temperature：0°C ~ 95°C (TC)
- Mounting Type：Surface Mount
- Package / Case：96-LFBGA
- Supplier Device Package：96-FBGA (9x13.5)
- Access Time：20 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for IM8G16D3FFBG-107
Memory IC Overview
The IM8G16D3FFBG-107I is an 8 Gbit DDR3L SDRAM component manufactured by Intelligent Memory. It features a 512 M x 16 organization with a 16-bit data bus width. The device supports a maximum clock frequency of 933 MHz, corresponding to a data rate of 1866 Mbps. It operates within a voltage range of 1.283 V to 1.45 V and includes a 20 ns access time. The memory is housed in a 96-ball FBGA package and is rated for industrial temperatures from -40°C to +95°C.
Memory IC Feature Summary
- Supports dual-voltage operation at 1.35V and 1.5V for compatibility with standard DDR3 systems.
- Provides high-speed data transfer capabilities through a 16-bit wide interface.
- Engineered for reliable performance across extended industrial temperature ranges.
Memory IC Applications
- Industrial control systems requiring robust memory solutions
- Automotive electronics operating in harsh environments
- Communication infrastructure equipment
Memory IC Procurement Notes
Verify the complete part number suffix, specifically 'I', which denotes the industrial temperature grade. Confirm that the required voltage levels align with the 1.35V/1.5V specification. Ensure the FBGA-96 footprint matches the target PCB design constraints before finalizing procurement orders.
Memory IC Selection Notes
Select this component when an 8 Gbit capacity with a 16-bit interface is required for DDR3L applications. It is suitable for designs needing extended temperature stability compared to commercial-grade alternatives. Consider the physical dimensions of the FBGA-96 package during layout planning.
Memory IC Part Context
This part belongs to the IM8G16D3 series of low-power DDR3 SDRAMs. It shares the same pinout and electrical characteristics as other variants in the family but differs in storage density or temperature rating. It serves as a direct replacement for similar 8Gb DDR3L chips in existing hardware architectures.
Memory IC Replacement Considerations
Compatible substitutes include the IM4G16D3FDBG-107I, though it offers half the storage density. Verify pin compatibility and timing parameters when considering alternative manufacturers' parts.
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