Memory IC IM8G16D3FFDG-107 product image

IM8G16D3FFDG-107

$19.25
  • Description:DDR3 8GB, 1.35V/1.5V, 512MX16 (2
  • Series:-
  • Mfr:Intelligent Memory Ltd.
  • Package:Tray

SKU:ca102126ce6a Category: Brand:

  
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IM8G16D3FFDG-107 is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is DDR3 8GB, 1.35V/1.5V, 512MX16 (2. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IM8G16D3FFDG-107

  • Description:DDR3 8GB, 1.35V/1.5V, 512MX16 (2
  • Series:-
  • Mfr:Intelligent Memory Ltd.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:8Gbit
  • Memory Organization:512M x 16
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-TFBGA
  • Supplier Device Package:96-FBGA (9x13.5)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IM8G16D3FFDG-107

IM8G16D3FFDG-107

Memory IC Overview

The IM8G16D3FFDG-107 is an 8 Gbit DDR3L SDRAM manufactured by Intelligent Memory. It features a 512 M x 16 organization with a 16-bit data bus width. The component supports a maximum clock frequency of 933 MHz, equivalent to 1866 Mbps data rate. Operating voltage ranges from 1.283 V to 1.45 V. Access time is specified at 20 ns. It operates within a temperature range of 0°C to +95°C and is housed in an FBGA-96 package.

Memory IC Feature Summary

  • Supports dual chip select (2CS) architecture for flexible memory configuration
  • Compatible with both 1.35V and 1.5V power supply standards
  • Designed for surface mount technology (SMD/SMT) installation

Memory IC Applications

  • Embedded systems requiring high-density volatile memory
  • Industrial control units operating in extended temperature environments
  • Consumer electronics utilizing DDR3L interface standards

Memory IC Procurement Notes

Verify the specific suffix 'DG' against the manufacturer's official datasheet to confirm pinout and electrical characteristics match your design requirements. Ensure the PCB footprint corresponds exactly to the FBGA-96 package dimensions. Confirm that the 0°C to +95°C industrial temperature range aligns with your system's thermal constraints before finalizing procurement.

Memory IC Selection Notes

Select this component when a 16-bit wide memory interface is required alongside 8 Gbit capacity. The DDR3L specification allows for lower power consumption compared to standard DDR3. Consider the FBGA-96 package size relative to available board space. Verify compatibility with the host controller's support for 933 MHz speeds and 2CS addressing modes.

Memory IC Part Context

This part belongs to the IM8G16D3 series of DDR3L dynamic random-access memories. It shares the same organizational structure as other variants in the family but differs in speed grade and package type. The '107' suffix typically denotes the specific speed bin and temperature rating within the product line.

Memory IC Replacement Considerations

Cross-reference with IM8G16D3FDBG-107I for similar specifications but verify package differences. Check IM8G08D3FFBG-107 if an 8-bit interface is acceptable instead of 16-bit. Always validate electrical parameters against the latest manufacturer documentation.

IM8G16D3FFDG-107IM8G16D3FFDG-107
$19.25
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