IM8G16D4GBBG-062I

Memory IC Overview

The IM8G16D4GBBG-062I is an 8 Gbit DDR4 SDRAM component manufactured by Intelligent Memory. It features a 512 M x 16 organization with a 16-bit data bus width. The device supports a maximum clock frequency of 1.6 GHz, enabling data transfer rates up to 3200 Mbps. It operates within a voltage range of 1.14 V to 1.26 V and functions in temperatures from 0°C to +95°C. The memory is housed in a 96-ball FBGA package designed for surface mount technology.

Memory IC Feature Summary

• Supports Data Bus Inversion (DBI) for improved signal integrity
• Includes Write Cycle Redundancy Check (CRC) capabilities
• Features Dynamic On-Die Termination (ODT)
• Utilizes Fine Granularity Refresh Mode

Memory IC Applications

• Industrial market applications requiring high-speed data transfer
• Systems demanding higher module density than DDR3 devices
• Equipment requiring lower voltage operation compared to previous generations

Memory IC Procurement Notes

Verify the specific suffix against official documentation to confirm if the 'I' designation indicates industrial temperature grading or other variations. Confirm RoHS compliance status through the manufacturer's detailed specifications. Ensure compatibility with the required PCB footprint and soldering profiles for the FBGA-96 package before finalizing procurement orders.

Memory IC Selection Notes

Select this component when designing systems that require DDR4 performance levels within an industrial temperature range. Consider the 16-bit interface width and 8 Gbit capacity for bandwidth requirements. Evaluate the power supply constraints to ensure they align with the specified 1.2V nominal operating voltage and the thermal management capabilities for the +95°C maximum junction temperature.

Memory IC Part Context

This part belongs to the Intelligent Memory DDR4 DRAM series, which offers higher density and speed than DDR3 alternatives. The IM8G16D4 series is specifically engineered for demanding industrial environments. These components provide enhanced reliability features such as CRC and DBI, making them suitable for critical infrastructure and robust electronic systems where data integrity is paramount.

Memory IC FAQ

What are the supported advanced features of this DDR4 device?

The device supports Data Bus Inversion (DBI), Write Cycle Redundancy Check (CRC), Dynamic On-Die Termination (ODT), and Fine Granularity Refresh Mode.

What is the operating temperature range for this component?

The component is rated for operation from 0°C to +95°C.