IM8G16L4JCBG-046I

Memory IC Overview

The IM8G16L4JCBG-046I is an LPDDR4x dynamic random-access memory (DRAM) component manufactured by Intelligent Memory. It features a storage capacity of 8 Gbit organized as 512M x 16 with a data bus width of 16 bits. The device supports a maximum clock frequency of 2.133 GHz and operates within a supply voltage range of 600 mV to 1.95 V. It is housed in a 200-ball FBGA package designed for surface-mount installation. The component is rated for an industrial operating temperature range from -40°C to +95°C.

Memory IC Feature Summary

• Supports LPDDR4x interface standards for high-speed mobile applications
• Provides 8 Gbit storage density with 16-bit data bus architecture
• Operates at frequencies up to 2.133 GHz for enhanced bandwidth
• Designed for robust performance across extended industrial temperature ranges

Memory IC Applications

• Mobile computing platforms requiring low-power DRAM solutions
• Industrial embedded systems operating in extreme temperatures
• Portable electronic devices utilizing LPDDR4x memory interfaces

Memory IC Procurement Notes

Verify the specific part number against official manufacturer documentation to ensure compatibility with system requirements. Confirm that the 200-ball FBGA package dimensions align with PCB layout specifications. Check for RoHS compliance status through authorized distributors. Ensure handling procedures account for moisture sensitivity levels indicated in the datasheet. Validate that the operating temperature range meets the environmental conditions of the intended application environment.

Memory IC Selection Notes

Select this component when an 8 Gbit LPDDR4x memory solution is required for mobile or industrial designs. Consider the 16-bit data bus width and 2.133 GHz speed for bandwidth needs. Evaluate the 200-ball FBGA footprint against available board space. Verify power supply constraints match the 600 mV to 1.95 V operating range. Assess thermal management capabilities to support the -40°C to +95°C operational window effectively.

Memory IC Part Context

This part belongs to the Intelligent Memory LPDDR4x series, targeting mobile and industrial markets. It offers a balance of high density and energy efficiency. The 200-ball FBGA package facilitates compact design integration. The component supports standard LPDDR4x signaling protocols for broad compatibility with modern processors and controllers.

Memory IC Replacement Considerations

The Micron MT53D512M16D1DS-046 is identified as a discontinued alternative. Verify pinout and electrical parameter compatibility before substitution. Ensure the replacement meets the same LPDDR4x specifications and package requirements.