ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
IMAG16L4JCDG-046 is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is LPDDR4X 16GB 1024MX16 2133MHZ FB. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IMAG16L4JCDG-046
- Description：LPDDR4X 16GB 1024MX16 2133MHZ FB
- Series：-
- Mfr：Intelligent Memory Ltd.
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - Mobile LPDDR4X
- Memory Size：16Gbit
- Memory Organization：1G x 16
- Memory Interface：Parallel
- Clock Frequency：2.133 GHz
- Write Cycle Time - Word, Page：18ns
- Voltage - Supply：1.17V ~ 1.06V, 1.95V ~ 1.7V
- Operating Temperature：-25°C ~ 85°C (TC)
- Mounting Type：Surface Mount
- Package / Case：200-VFBGA
- Supplier Device Package：200-FBGA (10x15)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for IMAG16L4JCDG-046
Memory IC Overview
The IMAG16L4JCDG-046 is a mobile LPDDR4X SDRAM component manufactured by Intelligent Memory. It features a storage capacity of 16 Gbit organized as 1024M x 16 bits. The device supports a maximum clock frequency of 2.133 GHz, enabling data rates up to 4266 Mbps. It operates within a voltage range of 0.6 V to 1.8 V and functions at temperatures between -20°C and +85°C. The memory is housed in a 200-ball FBGA package with surface mount installation.
Memory IC Feature Summary
- Supports LPDDR4X standard for enhanced power efficiency
- High-speed parallel interface architecture
- Mobile-optimized low voltage operation
Memory IC Applications
- Smartphones and mobile communication devices
- Tablets and portable computing systems
- Wearable electronics requiring compact memory solutions
Memory IC Procurement Notes
Verify the specific suffix codes against official Intelligent Memory documentation to confirm exact electrical characteristics and temperature ranges. Ensure compatibility with host controller interfaces supporting LPDDR4X standards. Confirm package dimensions and pinout alignment during PCB layout validation to prevent integration errors.
Memory IC Selection Notes
Select this component when high-density mobile memory is required within strict power constraints. The 16 Gbit capacity suits advanced multimedia applications. Verify that the system design accommodates the 200-ball FBGA footprint and thermal requirements for the specified operating temperature range.
Memory IC Part Context
This part belongs to the Intelligent Memory LPDDR4X series, designed for mobile applications. It represents an evolution in mobile DRAM technology, offering higher bandwidth and lower power consumption compared to previous generations. The series targets the growing demand for efficient memory in compact consumer electronics.
Memory IC FAQ
What is the organization of the IMAG16L4JCDG-046 memory array?
The memory array is organized as 1024M x 16 bits.
Does this component support LPDDR4 or LPDDR4X modes?
The datasheet identifies it specifically as an LPDDR4X SDRAM component.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
