Memory IC IMAG16L4JCDG-046I product image

IMAG16L4JCDG-046I

$16.90
  • Description:LPDDR4X 16GB 1024MX16 2133MHZ FB
  • Series:-
  • Mfr:Intelligent Memory Ltd.
  • Package:Tray

SKU:d1ee60605901 Category: Brand:

  
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IMAG16L4JCDG-046I is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is LPDDR4X 16GB 1024MX16 2133MHZ FB. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IMAG16L4JCDG-046I

  • Description:LPDDR4X 16GB 1024MX16 2133MHZ FB
  • Series:-
  • Mfr:Intelligent Memory Ltd.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4X
  • Memory Size:16Gbit
  • Memory Organization:1G x 16
  • Memory Interface:Parallel
  • Clock Frequency:2.133 GHz
  • Write Cycle Time - Word, Page:18ns
  • Voltage - Supply:1.17V ~ 1.06V, 1.95V ~ 1.7V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:200-VFBGA
  • Supplier Device Package:200-FBGA (10x15)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IMAG16L4JCDG-046I

IMAG16L4JCDG-046I

Memory IC Overview

The IMAG16L4JCDG-046I is a Low-Power Double Data Rate 4X (LPDDR4X) dynamic random-access memory component manufactured by Intelligent Memory. It features a storage capacity of 16 Gbit organized as 1024M x 16 bits. The device supports a maximum clock frequency of 2133 MHz, enabling data rates up to 4266 Mbps. It operates within an extended industrial temperature range from -40°C to +85°C and utilizes a 200-pin Fine-pitch Ball Grid Array (FBGA) package measuring 10x15 mm for surface mount installation.

Memory IC Feature Summary

  • Integrates error correction capabilities to enhance data integrity during operation
  • Supports LPDDR4 and LPDDR4X modes for flexible system compatibility
  • Designed for low-power consumption in mobile and embedded applications

Memory IC Applications

  • Mobile computing devices requiring high bandwidth and power efficiency
  • Industrial embedded systems operating in extended temperature environments
  • IoT gateways and edge processing units with memory constraints

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm the exact operational parameters and temperature grade. Ensure that the procurement channel provides valid traceability for the component's manufacturing origin. Confirm compliance with relevant environmental standards such as RoHS requirements before finalizing acquisition orders.

Memory IC Selection Notes

Select this component when a 16 Gbit density is required alongside integrated error correction functionality. The industrial temperature rating makes it suitable for harsh environments where standard commercial grades may fail. Consider the FBGA-200 footprint for PCB layout compatibility with existing designs utilizing similar memory form factors.

Memory IC Part Context

This part belongs to the Intelligent Memory LPDDR4/4X Combo series, which combines LPDDR4 and LPDDR4X functionalities. It is designed to offer enhanced reliability through built-in error correction mechanisms. The series targets applications demanding high performance within strict power and thermal constraints.

Memory IC Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.

IMAG16L4JCDG-046IIMAG16L4JCDG-046I
$16.90
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