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IMC1B1A4C3A9A5I3A4A0000 is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is EMMC, 11.5X13 153 BALL, 8GB, -40. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IMC1B1A4C3A9A5I3A4A0000
- Description：EMMC, 11.5X13 153 BALL, 8GB, -40
- Series：-
- Mfr：Intelligent Memory Ltd.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (SLC)
- Memory Size：64Gbit
- Memory Organization：8G x 8
- Memory Interface：eMMC_5.1
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：153-VFBGA
- Supplier Device Package：153-FBGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for IMC1B1A4C3A9A5I3A4A0000
Memory IC Overview
The IMC1B1A4C3A9A5I3A4A0000 is an embedded multimedia card (eMMC) memory IC manufactured by Intelligent Memory Ltd. It utilizes SLC NAND flash technology with a total storage capacity of 64Gbit, organized as 8G x 8 bits. The component adheres to the eMMC 5.1 interface standard and is housed in a 153-ball FBGA package measuring 11.5 mm by 13 mm. It supports surface mount installation and operates within a temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Complies with eMMC 5.1 interface specifications for standardized connectivity
- Utilizes SLC NAND flash architecture for non-volatile data retention
- Designed for surface mount assembly on printed circuit boards
Memory IC Applications
- Industrial control systems requiring robust data storage
- Automotive electronics operating in extended temperature ranges
- Embedded devices utilizing eMMC 5.1 compatible controllers
Memory IC Procurement Notes
Verify current availability status directly with authorized distributors or the manufacturer, as supply conditions may vary. Confirm that the specific package dimensions and pinout match your design requirements. Ensure compliance with RoHS directives and check for any relevant export control classifications such as EAR99 before finalizing procurement plans.
Memory IC Selection Notes
Select this component when an eMMC 5.1 interface is required alongside industrial-grade temperature tolerance. The 153-ball FBGA form factor suits compact designs needing high-density storage. Verify controller compatibility with the 8G x 8 organization and ensure the PCB layout accommodates the specified package footprint and thermal characteristics.
Memory IC Part Context
This part belongs to the Intelligent Memory embedded storage portfolio, focusing on reliable NAND flash solutions. It represents a specific configuration within their eMMC lineup, tailored for applications demanding durability and standardized interfaces. The product distinguishes itself through its industrial temperature rating and specific organizational structure.
Memory IC Replacement Considerations
Check for direct substitutes from Intelligent Memory with identical eMMC 5.1 support and 153-FBGA packaging. Ensure any replacement maintains the -40°C to +85°C operating range and SLC NAND technology. Verify pin-to-pin compatibility and electrical parameters before integration.
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