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IMC1B1A5C3A9A5E3A5A0000 is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is EMMC, 11.5X13 153 BALL, 16GB, -2. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IMC1B1A5C3A9A5E3A5A0000
- Description：EMMC, 11.5X13 153 BALL, 16GB, -2
- Series：-
- Mfr：Intelligent Memory Ltd.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (SLC)
- Memory Size：128Gbit
- Memory Organization：16G x 8
- Memory Interface：eMMC_5.1
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-25°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：153-VFBGA
- Supplier Device Package：153-FBGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for IMC1B1A5C3A9A5E3A5A0000
Memory IC Overview
The IMC1B1A5C3A9A5E3A5A0000 is a non-volatile NAND flash memory integrated circuit manufactured by Intelligent Memory Ltd. It utilizes SLC technology and offers a storage capacity of 128Gb, organized as 16G x 8 bits. The device implements the eMMC 5.1 interface standard for high-speed data transfer. It is housed in a 153-ball VFBGA package with dimensions of 11.5mm x 13mm. The component supports an operating temperature range from -25°C to 85°C (TA) and complies with RoHS3 specifications.
Memory IC Feature Summary
- Supports eMMC 5.1 interface protocol for embedded multimedia card applications
- Utilizes Single-Level Cell (SLC) NAND flash technology for reliable data retention
- Designed for surface-mount installation in compact electronic assemblies
Memory IC Applications
- Embedded systems requiring robust non-volatile storage
- Industrial control units operating within extended temperature ranges
- Multimedia devices utilizing eMMC standards
Memory IC Procurement Notes
Verify part status carefully as this component may be obsolete or discontinued. Confirm current availability through authorized distributors or direct manufacturer channels. Ensure compatibility with existing PCB footprints and firmware requirements before procurement. Check for alternative sourcing options if original supply is unavailable.
Memory IC Selection Notes
Select this component when SLC reliability and eMMC 5.1 compliance are required. Consider the 153-ball FBGA package constraints during layout design. Evaluate thermal management needs given the -25°C to 85°C operating range. Verify voltage levels and interface signaling against system specifications.
Memory IC Part Context
This part belongs to the Intelligent Memory Ltd. NAND flash memory portfolio. It serves as a storage solution for embedded applications needing standardized interfaces. The 128Gb capacity provides substantial storage density within a small form factor suitable for portable and industrial electronics.
Memory IC Replacement Considerations
Check for direct substitutes with identical pinouts and electrical characteristics. Verify that any replacement maintains eMMC 5.1 compatibility and SLC technology. Ensure physical dimensions match the 153-FBGA(11.5x13) footprint.
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