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IMC1B1A8C2A2A1E3A6A0000 is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is EMMC, 11.5X13 153 BALL, 32GB, -2. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IMC1B1A8C2A2A1E3A6A0000
- Description：EMMC, 11.5X13 153 BALL, 32GB, -2
- Series：-
- Mfr：Intelligent Memory Ltd.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (SLC)
- Memory Size：256Gbit
- Memory Organization：32G x 8
- Memory Interface：eMMC_5.1
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-25°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：153-VFBGA
- Supplier Device Package：153-FBGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for IMC1B1A8C2A2A1E3A6A0000
Memory IC Overview
The IMC1B1A8C2A2A1E3A6A0000 is a 32GB eMMC 5.1 flash memory component manufactured by Intelligent Memory Ltd. It utilizes SLC NAND technology and is housed in a 153-ball FBGA package with dimensions of 11.5x13 mm. The device operates within an industrial temperature range of -25°C to +85°C. This embedded multimedia card provides reliable data storage solutions for applications requiring robust performance and vibration resistance.
Memory IC Feature Summary
- Industrial-grade reliability with vibration resistance
- Small form factor with 0.5mm pitch FBGA-153 package
- Superior power efficiency for embedded systems
Memory IC Applications
- Industrial control systems
- Automotive infotainment units
- Embedded IoT devices
Memory IC Procurement Notes
Verify the specific capacity and temperature grade against project requirements, as variations exist within the Ruby series. Confirm RoHS compliance status directly with the manufacturer or authorized distributors. Check current supply chain constraints, as availability may be limited. Ensure the 153-ball FBGA footprint matches the PCB design specifications before finalizing procurement orders.
Memory IC Selection Notes
Select this component when industrial temperature stability and shock resistance are critical. The SLC NAND architecture offers higher endurance compared to MLC alternatives. Consider the 11.5x13 mm package size for space-constrained designs. Verify compatibility with eMMC 5.1 host controllers for optimal interface performance.
Memory IC Part Context
This part belongs to Intelligent Memory's Ruby series of embedded multimedia cards. The series focuses on providing high-reliability storage solutions for harsh environments. The 153-ball FBGA format is standard for compact embedded applications requiring durable flash memory integration.
Memory IC Replacement Considerations
Cross-reference with other Intelligent Memory Ruby series parts for capacity upgrades. Verify pin-to-pin compatibility with existing 153-ball FBGA footprints before substituting.
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