IMC1B1A8C2A2A1E3A8A0000

$15.38

Description：EMMC, 11.5X13 153 BALL, 64GB, -2
Series：-
Mfr：Intelligent Memory Ltd.
Package：Tray

SKU:b6a9abb66a87 Category: Memory IC Brand: Intelligent Memory Ltd.

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Product introduction

IMC1B1A8C2A2A1E3A8A0000 is listed in the Memory IC range at ChipApex. The manufacturer field lists Intelligent Memory Ltd.. Its product description is EMMC, 11.5X13 153 BALL, 64GB, -2. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IMC1B1A8C2A2A1E3A8A0000

Description：EMMC, 11.5X13 153 BALL, 64GB, -2
Series：-
Mfr：Intelligent Memory Ltd.
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND (SLC)
Memory Size：512Gbit
Memory Organization：64G x 8
Memory Interface：eMMC_5.1
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：-
Operating Temperature：-25°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：153-VFBGA
Supplier Device Package：153-FBGA (11.5x13)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for IMC1B1A8C2A2A1E3A8A0000

IMC1B1A8C2A2A1E3A8A0000

Memory IC Overview

The IMC1B1A8C2A2A1E3A8A0000 is a 64GB eMMC 5.1 NAND flash memory component manufactured by Intelligent Memory Ltd. It utilizes Single-Level Cell (SLC) technology and is housed in a 153-ball FBGA package measuring 11.5x13 mm with a 0.5mm pitch. The device operates within a temperature range of -25°C to +85°C and supports a maximum clock frequency of 200MHz.

Memory IC Feature Summary

Vibration resistance for robust performance
Superior power efficiency
Small form factor design

Memory IC Applications

Industrial-grade embedded storage systems
Vibration-sensitive electronic environments
Power-efficient mobile devices

Memory IC Procurement Notes

Verify the specific operating temperature grade, as some listings indicate -25°C to +85°C while others may imply industrial ranges. Confirm the exact capacity and interface version against the official datasheet before integration. Ensure the 153-pin FBGA footprint matches the target PCB layout requirements precisely.

Memory IC Selection Notes

Select this component when SLC reliability and vibration resistance are critical. The 153-ball FBGA package suits space-constrained designs requiring high-density storage. Verify compatibility with eMMC 5.1 controllers and ensure the thermal environment stays within the specified operational limits.

Memory IC Part Context

This part belongs to the Intelligent Memory Silver series, which focuses on industrial-grade NAND flash solutions. The series emphasizes durability and efficiency in small packages. It serves as a specialized embedded storage option for demanding applications where standard consumer components may fail under stress.