IME4G32L4HABG-062I

Memory IC Overview

The IME4G32L4HABG-062I is a mobile LPDDR4 dynamic random-access memory (DRAM) integrated circuit manufactured by Intelligent Memory Ltd. It provides a total storage capacity of 4 Gbit, organized as 128M x 32 bits. The device operates with a maximum clock frequency of 1.6 GHz, supporting a data transfer rate of 3200 Mbps. It functions at a standard voltage of 1.1V and utilizes an LVSTL interface. The component is housed in a 200-ball FBGA package measuring 10x14.5 mm. It supports an extended industrial operating temperature range from -40°C to +95°C.

Memory IC Feature Summary

• Supports ECC functionality for enhanced data integrity
• Complies with AEC-Q100 automotive qualification standards
• Features low-voltage operation for power efficiency

Memory IC Applications

• Automotive infotainment systems
• Advanced driver-assistance systems (ADAS)
• Industrial control units requiring high reliability

Memory IC Procurement Notes

Verify the specific suffix '062I' corresponds to the required temperature grade and speed bin. Confirm that the 200-FBGA footprint matches the target PCB design. Ensure supply chain sources provide valid traceability documentation for automotive-grade components. Check for moisture sensitivity level requirements during assembly handling.

Memory IC Selection Notes

Select this part when a 4 Gbit LPDDR4 solution with built-in error correction is required. It is suitable for applications demanding AEC-Q100 compliance and wide temperature stability. Consider the 128M x 32 organization for bandwidth needs. Evaluate the 200-ball FBGA package constraints against available board space.

Memory IC Part Context

This component belongs to Intelligent Memory's LPDDR4 portfolio designed for mobile and automotive markets. It combines high-speed DRAM technology with automotive-grade reliability features. The series targets applications where data accuracy and environmental robustness are critical performance factors.

Memory IC Replacement Considerations

Direct substitutes must match the 4 Gbit capacity, LPDDR4 protocol, 128Mx32 organization, and 200-FBGA package. Verify equivalent AEC-Q100 certification and ECC support. Cross-reference pinouts and electrical specifications before integration.