IME8G32L4HADG-062I

Memory IC Overview

The IME8G32L4HADG-062I is an 8 Gbit LPDDR4 dynamic random-access memory component manufactured by Intelligent Memory. It features a 32-bit data bus width and operates at a maximum clock frequency of 1.6 GHz (3200 Mbps). The device is organized as 256M x 32 and functions within a supply voltage range of 1.06 V to 1.17 V. It supports ECC functionality and is housed in a 200-ball FBGA package suitable for surface mount technology. The operational temperature range spans from -40°C to +95°C, ensuring reliability in demanding environments.

Memory IC Feature Summary

• Supports Low Power Double Data Rate 4 (LPDDR4) interface standards for high-speed data transfer.
• Integrates Error Correction Code (ECC) capabilities to enhance data integrity.
• Operates with low power consumption characteristics typical of LPDDR4 technologies.
• Designed for robust performance across extended industrial temperature ranges.

Memory IC Applications

• Mobile computing platforms requiring high bandwidth and power efficiency
• Industrial control systems operating in extreme temperatures
• Automotive infotainment and telematics modules
• Embedded systems needing reliable error-correcting memory

Memory IC Procurement Notes

Verify the specific ordering suffix and revision level against the manufacturer's latest datasheet before procurement. Confirm that the FBGA-200 footprint matches the target PCB design. Ensure compatibility with the system's voltage regulation and signal integrity requirements. Check for moisture sensitivity handling instructions if storage conditions vary. Validate that the ECC support aligns with the host controller's capabilities.

Memory IC Selection Notes

Select this component when an 8 Gbit capacity with a 32-bit interface is required. Consider the LPDDR4 standard for improved power efficiency over previous generations. The wide temperature range makes it suitable for harsh environments. Verify that the host processor supports the 1.6 GHz speed grade. Ensure the system design accommodates the 200-ball FBGA package constraints.

Memory IC Part Context

This part belongs to the Intelligent Memory LPDDR4 DRAM family, specifically designed for mobile and embedded applications. It represents a generation of memory offering higher density and lower voltage operation compared to DDR3 solutions. The product line emphasizes reliability and performance for compact electronic devices.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Consult the manufacturer directly for qualified alternatives or pin-compatible upgrades.