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IN610-Q1-R-G4C0I is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists InPlay Inc. Its product description is IC RF TXRX+MCU BLE 48QFN. Review the specifications below when checking this part for your BOM.
The IN610-Q1-R-G4C0I is a Bluetooth v5.0 RF transceiver and MCU integrated into a 48-VFQFN package with an exposed pad. Operating at 2.4GHz, it delivers 3dBm output power and -104.5dBm sensitivity at 2Mbps data rates using GFSK modulation. The device includes 512kB Flash, 256kB ROM, and 96kB SRAM. It supports ADC, GPIO, I2C, I2S, PDM, PWM, SPI, and UART interfaces. Supply voltage ranges from 1.7V to 3.6V, with receive current of 7mA-8.3mA and transmit current of 6.5mA-9.6mA. It functions within -40°C to 85°C.
Verify the specific suffix 'Q1' indicates automotive-grade qualification requirements if applicable to your design. Confirm the 'R' designation aligns with reel packaging specifications for automated assembly processes. Ensure the 48-VFQFN footprint matches your PCB layout constraints. Cross-reference the datasheet revision date against your production timeline to ensure component availability and documentation accuracy. Validate moisture sensitivity level (MSL 3) handling procedures during storage and reflow soldering.
Select this component when a unified solution for BLE connectivity and microcontroller processing is required to reduce board space. Consider the 512kB Flash capacity for complex application logic without external memory. Evaluate the 30 GPIO count against interface requirements for sensors and displays. The wide supply voltage range accommodates various battery types. Assess thermal performance needs given the exposed pad package for heat dissipation in enclosed designs.
This part belongs to the IN6XX series from InPlay Inc, designed for compact wireless applications. It combines RF capabilities with digital signal processing, targeting markets requiring small form factors and efficient power management. The integration reduces bill-of-materials complexity by merging transceiver and MCU functions into a single silicon die.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing firmware architectures if considering alternative MCUs. Check pin-to-pin compatibility if substituting with other InPlay series devices, noting potential differences in memory size or peripheral counts.
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