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INA205AIDGSR is listed in the Current Regulation/Management range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC CURRENT MONITOR 3.5% 10VSSOP. Review the specifications below when checking this part for your BOM.
The INA205AIDGSR is a unidirectional current shunt monitor manufactured by Texas Instruments, designed for high-side measurement applications. It operates within a supply voltage range of 2.7 V to 18 V and supports input common-mode voltages from -16 V to 80 V. The device features a typical operating supply current of 2.8 mA and is housed in a TSSOP-14 surface-mount package. It functions effectively across an extended temperature range from -40°C to +125°C, providing reliable performance for industrial and commercial monitoring systems requiring precise current sensing.
Verify the specific suffix 'DGSR' corresponds to the MSOP-10 package and tape-and-reel delivery format as specified in the official datasheet. Confirm that the A-grade variant meets the required accuracy specifications for your application. Ensure compatibility with your PCB footprint and reflow soldering profile requirements before finalizing procurement orders.
Select this component when high-side measurement capability is required with a wide common-mode voltage range extending up to 80 V. Consider the MSOP-10 package size constraints and the 2.8 mA quiescent current impact on total system power budget. Evaluate thermal performance needs given the +125°C maximum operating temperature rating for harsh environments.
This part belongs to the INA205 series of current shunt monitors from Texas Instruments. It complements other devices like the INA203 and INA206, offering similar functionality but potentially differing in package options or specific grade variations. The series is categorized under Current & Power Monitors & Regulators within the PMIC product family.
The INA205AIPWR serves as a pin-compatible alternative featuring a TSSOP-14 package instead of the MSOP-10 form factor. Verify mechanical fit and thermal characteristics when substituting between these package types.
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