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The INA240A2QDRQ1 is a high-side current sense amplifier from Texas Instruments, designed for bidirectional current measurement in automotive and industrial applications. It operates with a common-mode voltage range of -4 V to 80 V and supports a supply voltage between 2.7 V and 5.5 V. The device features a fixed gain of 50 V/V, a 3dB bandwidth of 400 kHz, and a gain-bandwidth product of 100 kHz. Key electrical specifications include a maximum input offset voltage of 5 µV, an input bias current of 90 µA, and a typical common-mode rejection ratio (CMRR) of 132 dB. It consumes 2.4 mA of operating current and is qualified under AEC-Q100 standards for automotive use.
Verify the specific suffix QDRQ1 confirms AEC-Q100 automotive qualification and SOIC-8 packaging. Ensure compatibility with system voltage levels within the specified 2.7 V to 5.5 V range. Confirm moisture sensitivity level handling requirements during assembly. Cross-reference datasheet revisions for any updates to electrical characteristics or recommended footprint dimensions before finalizing procurement.
Select this component when bidirectional sensing is required at high common-mode voltages up to 80 V. The fixed 50 V/V gain suits applications needing moderate amplification without external resistors. Consider the 400 kHz bandwidth for dynamic load monitoring. Compare against other INA240 variants if different gain factors or package types are preferred for space constraints.
This part belongs to the INA240 family of ultra-precise, bidirectional current-sense amplifiers. It shares core architecture with non-automotive grades but includes additional reliability testing for automotive environments. The QDRQ1 designation indicates automotive qualification, reel packaging, and temperature grade specifications distinct from commercial counterparts like the INA240A2DR.
INA240A2DR serves as the commercial equivalent without automotive qualification. INA240A2QPWRQ1 offers the same electrical performance in a TSSOP-8 package. Verify pinout compatibility and thermal dissipation differences when substituting packages.