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INA500CIDCKR is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is LOW-POWER, 1-M RIN, 20-A IQ, SMA. Review the specifications below when checking this part for your BOM.
The INA500CIDCKR is a cost-optimized, low-power difference amplifier from Texas Instruments. It operates on a single supply of 1.7V to 5.5V or dual supplies of ±0.85V to ±2.75V. This specific variant features a fixed gain of G = 1 and is housed in a 6-pin SC70 (DCK) package measuring 2.1mm x 1.25mm. Key electrical characteristics include an ultra-high input impedance exceeding 1MΩ, a typical bandwidth of 125kHz, and a low quiescent current of 13.5µA at 5.5V. The device offers precision suitable for 8-bit to 12-bit systems with a typical CMRR of 87dB and gain error of ±0.01%.
Verify that the ordering suffix 'CKR' corresponds to the SC70 package and tape-and-reel delivery format as specified in the manufacturer's orderable information. Confirm the 'C' grade designation aligns with the required temperature range and performance specifications for your application environment before finalizing procurement.
Select this component when a fixed unity gain configuration is required alongside minimal board footprint constraints. The SC70 package is ideal for space-sensitive designs compared to larger SOT-23 options. Ensure the application does not require gains of 0.5 or 0.25, which are available in other variants of the INA500 family.
The INA500 series includes variants with different fixed gains: INA500A (G=1), INA500B (G=0.5), and INA500C (G=0.25). The CIDCKR part specifically denotes the C-grade version with a gain of 1, packaged in the compact SC70 form factor. This distinguishes it from the DBV (SOT-23) and DTQ (X2SON) package options available within the same product line.
Direct functional substitutes within the same family include INA500ACDR (same gain, different package) or INA500BCDR/INA500CCDR if gain adjustment is permissible. Verify pin compatibility and thermal characteristics when replacing with packages of different physical dimensions.
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