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IRSM505-065DA is listed in the Full Half-Bridge (H Bridge) Drivers range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC HALF BRIDGE DRIVER 2.6A 23DIP. Review the specifications below when checking this part for your BOM.
The IRSM505-065DA is a 3-phase Integrated Power Module (IPM) from Infineon’s CIPOS Micro series, designed for advanced motor drive applications. It integrates three half-bridge drivers with UMOS technology in a 23-DIP package. Key electrical parameters include a maximum load voltage of 400V and a supply voltage range of 13.5V to 16.5V. The module provides an output current of 2.6A per channel with a peak output capability of 15A. It features an on-state resistance of approximately 1 Ohm and operates within a junction temperature range of -40°C to 150°C.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific datasheet revision and ordering suffix to ensure compatibility with existing designs. Note that this product may be subject to end-of-life status; check current availability and lifecycle notifications before finalizing procurement plans.
Select this IPM for applications requiring integrated 3-phase driving capabilities in a through-hole DIP package. Ensure the system design accommodates the specified 400V load voltage and 13.5V–16.5V supply requirements. Consider thermal management solutions suitable for the 150°C junction temperature limit and verify interface logic levels match the control circuitry.
The IRSM505-065DA belongs to Infineon’s CIPOS Micro and µIPM-DIP families, which consolidate power switching and gate drive functions into single packages. This integration reduces board space and simplifies layout compared to discrete solutions. The module is part of a broader series including variants like the IRSM515-065DA, tailored for different packaging or performance needs within the same voltage class.
The IRSM515-065DA is a documented substitute within the same series. Verify pinout compatibility and specific parameter differences such as on-state resistance or package variations before substitution.
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