IRSM505-084DA2

Full Half-Bridge (H Bridge) Drivers Overview

The IRSM505-084DA2 is a three-phase half-bridge driver IC from the µIPM-DIP series, designed for AC motor applications. It features a 23-DIP module package with through-hole mounting. The device operates within a supply voltage range of 13.5V to 16.5V and supports load voltages up to 200V maximum. It delivers an output current of 4.6A per channel with a peak output capability of 15A. The typical on-resistance is 340 milliohms. Operating junction temperature ranges from -40°C to +150°C.

Full Half-Bridge (H Bridge) Drivers Feature Summary

• Integrates three half-bridge drivers in a single DIP module
• Includes bootstrap circuit functionality for high-side driving
• Provides undervoltage lockout (UVLO) fault protection
• Utilizes UMOS technology for power switching

Full Half-Bridge (H Bridge) Drivers Applications

• AC motor drive systems
• Motion control circuits
• Industrial motor controllers

Full Half-Bridge (H Bridge) Drivers Procurement Notes

Verify component authenticity and datasheet version upon receipt. Confirm package integrity and pin alignment against the 23-DIP specification. Check for obsolescence status as this part may be discontinued or subject to limited supply constraints. Ensure compatibility with existing PCB footprints and thermal management requirements before integration.

Full Half-Bridge (H Bridge) Drivers Selection Notes

Select this component for designs requiring integrated three-phase half-bridge driving in a through-hole package. Consider the 200V load voltage limit and 4.6A continuous output current when sizing external components. Evaluate thermal dissipation needs given the 340 milliohm on-resistance and operating temperature range. Verify logic interface compatibility with the controlling microcontroller.

Full Half-Bridge (H Bridge) Drivers Part Context

This driver belongs to Infineon's CIPOS Micro and µIPM-DIP families, which consolidate power stages into compact modules. These devices simplify the design of motor drives by integrating gate drivers and power switches. The DIP packaging facilitates prototyping and through-hole assembly processes compared to surface-mount alternatives.

Full Half-Bridge (H Bridge) Drivers Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.