IS21EF04GP-BCLI-TR

Memory IC Overview

The IS21EF04GP-BCLI-TR is a 4GB eMMC device manufactured by ISSI, utilizing pSLC NAND technology and compliant with the eMMC 5.1 specification. It features an HS400 interface supporting up to 200MHz clock frequency with configurable 1-bit, 4-bit, or 8-bit data bus widths. The component operates within a VCCQ range of 1.7V/2.7V to 1.95V/3.6V and a VCC range of 2.7V to 3.6V. Available in 153-ball FBGA (11.5mm x 13mm x 1.0mm) and 100-ball FBGA packages, it supports industrial (-40°C to 85°C) and automotive A2 (-40°C to 105°C) temperature grades.

Memory IC Feature Summary

• Configured as pseudo-SLC (pSLC) mode to enhance read/write performance, endurance, and reliability compared to standard MLC configurations.
• Integrates internal error correction code (ECC), enhanced data management algorithms, and solid protection against sudden power failure for safe-update operations.
• Supports advanced eMMC 5.1 features including Field Firmware Update (FFU), Power Off Notification, Pre-EOL information, Enhanced Device Lifetime, and Secure Write Protection.

Memory IC Applications

• Embedded storage solutions for industrial applications requiring high performance across wide operating temperatures
• Automotive application storage systems demanding extended temperature ranges and reliability
• High-speed embedded memory interfaces utilizing HS200 and HS400 modes

Memory IC Procurement Notes

Verify the specific suffix 'BCLI' against official ordering lists to confirm package type and boot partition sizes. Confirm whether the device requires the 153-ball or 100-ball FBGA footprint based on the suffix designation. Ensure compatibility with host controllers supporting eMMC 5.1 protocols and HS400 signaling requirements before procurement.

Memory IC Selection Notes

Select this component when pSLC endurance and speed are prioritized over raw density. Verify that the host system supports the required VCCQ voltage levels (1.8V or 3.3V) and can handle the current consumption profiles specified for HS400 and HS200 modes. Ensure the PCB layout accommodates the specific FBGA package dimensions and pinout configuration associated with the BCLI suffix.

Memory IC Part Context

This part belongs to the IS21EF04GP/8GP series from Integrated Silicon Solution Inc. It is designed as a JEDEC standard eMMC package combining NAND flash and a controller. The series targets embedded storage needs where reliability and high-speed data transfer are critical, offering both industrial and automotive grade options within the same functional family.

Memory IC Replacement Considerations

Check datasheet section 10 for valid part numbers. Suffixes typically indicate package variations (e.g., 153 vs 100 ball) or boot partition configurations. Direct substitution requires matching the exact package dimensions and electrical characteristics.