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IS22ES08G-JCLA1 is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC FLASH 64GBIT EMMC 153VFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IS22ES08G-JCLA1
- Description：IC FLASH 64GBIT EMMC 153VFBGA
- Series：-
- Mfr：ISSI, Integrated Silicon Solution Inc
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (MLC)
- Memory Size：64Gbit
- Memory Organization：8G x 8
- Memory Interface：eMMC
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：153-VFBGA
- Supplier Device Package：153-VFBGA (11.5x13)
- Access Time：-
- Grade：Automotive
- Qualification：AEC-Q100
Memory IC datasheet and documents for IS22ES08G-JCLA1
Memory IC Overview
The IS22ES08G-JCLA1 is an automotive-grade embedded multimedia card manufactured by ISSI. It provides 8GB of storage capacity using MLC NAND flash technology within a 153-ball FBGA package measuring 11.5mm x 13mm x 1.0mm. The device operates with VCC at 3.3V and VCCQ between 1.8V and 3.3V, supporting temperatures from -40°C to 85°C. It complies with eMMC 5.0 specifications, offering sequential read speeds up to 250MB/s and write speeds up to 27.3MB/s in HS400 mode.
Memory IC Feature Summary
- Compliant with eMMC 5.0 specification for high-speed data transfer
- Supports pseudo-SLC configuration for enhanced endurance
- Includes internal ECC and safe-update operations
- Features boot partitions and replay-protected memory blocks
Memory IC Applications
- Automotive infotainment systems
- Industrial embedded storage solutions
- High-performance mobile devices
Memory IC Procurement Notes
Verify the specific suffix JCLA1 confirms the automotive grade (-40°C to 85°C) and 153-ball FBGA package. Confirm RoHS compliance status directly with the manufacturer or authorized distributors as required for your region. Ensure voltage requirements match your system design before ordering.
Memory IC Selection Notes
Select this component when automotive reliability and wide temperature operation are required. The 153-ball FBGA package suits compact designs needing high density. Consider the pseudo-SLC mode if higher endurance is critical compared to standard MLC configurations.
Memory IC Part Context
This part belongs to the IS22ES08G series, which integrates an eMMC controller and MLC NAND flash into a single JEDEC-standard package. The series supports various bus widths and high-speed modes like HS200 and HS400, designed for robust performance in demanding environments.
Memory IC Replacement Considerations
Check datasheet compatibility for pinout and electrical characteristics when substituting. Verify that alternative parts support the same eMMC 5.0 interface and automotive temperature range.
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