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IS25LP512MJ-RHLA3-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is 512MB QPI/QSPI, 24-BALL TFBGA 6X. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IS25LP512MJ-RHLA3-TR
- Description：512MB QPI/QSPI, 24-BALL TFBGA 6X
- Series：-
- Mfr：ISSI, Integrated Silicon Solution Inc
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
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Memory IC datasheet and documents for IS25LP512MJ-RHLA3-TR
Memory IC Overview
The IS25LP512MJ-RHLA3-TR is a non-volatile NOR flash memory device manufactured by ISSI. It features a storage capacity of 512 Mbit organized as 64M x 8 bits. The component supports SPI, Quad I/O, QPI, and DTR interfaces with a maximum clock frequency of 133 MHz. It operates within a supply voltage range of 2.3V to 3.6V and is housed in a 24-ball TFBGA package measuring 6x8mm. The device is rated for an extended operating temperature range from -40°C to +105°C and holds AEC-Q100 automotive qualification.
Memory IC Feature Summary
- Supports high-speed data transfer via SPI, Quad I/O, QPI, and DTR interface modes
- Includes a dedicated reset pin for system reliability
- Automotive-grade construction certified under AEC-Q100 standards
- Provides flexible power management with a wide voltage operating range
Memory IC Applications
- Automotive infotainment systems requiring robust data retention
- Industrial control units needing extended temperature tolerance
- Embedded applications utilizing code execution directly from memory
Memory IC Procurement Notes
Verify the specific suffix 'J' against official ISSI documentation to confirm exact package dimensions and thermal characteristics. Ensure compatibility with existing PCB footprints for the 24-ball TFBGA configuration. Confirm that the required interface modes align with the host controller's capabilities. Validate that the operating voltage range meets the system power supply specifications.
Memory IC Selection Notes
Select this component when a 512 Mbit capacity is required for automotive or industrial environments. The choice is driven by the need for AEC-Q100 certification and extended temperature operation. Consider the 24-ball TFBGA package for space-constrained designs requiring a reset pin. Verify that the host system supports the necessary SPI or QPI interface protocols for optimal performance.
Memory IC Part Context
This part belongs to the IS25LP512M series of NOR flash memories from ISSI. The series offers various packaging options including SOIC, WSON, and TFBGA configurations. All variants share the same core 512 Mbit architecture and interface capabilities but differ in physical footprint and thermal properties. The RHLA3 suffix indicates the specific 24-ball TFBGA package variant.
Memory IC Replacement Considerations
Cross-reference with other IS25LP512M variants such as IS25LP512M-RHLE if package differences are acceptable. Verify functional equivalence with other automotive-grade 512 Mbit NOR flashes from different manufacturers only after confirming pinout and electrical parameter alignment.
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