Memory IC IS42S16400D-7TI product image

IS42S16400D-7TI

$2.96
  • Description:IC DRAM 64MBIT PAR 54TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray

SKU:9c8bf49763ba Category: Brand:

  
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IS42S16400D-7TI is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 64MBIT PAR 54TSOP II. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS42S16400D-7TI

  • Description:IC DRAM 64MBIT PAR 54TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM
  • Memory Size:64Mbit
  • Memory Organization:4M x 16
  • Memory Interface:Parallel
  • Clock Frequency:143 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:54-TSOP (0.400", 10.16mm Width)
  • Supplier Device Package:54-TSOP II
  • Access Time:5.4 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS42S16400D-7TI

IS42S16400D-7TI

Memory IC Overview

The IS42S16400D is a 64Mb Synchronous DRAM organized as 1 Megabit x 16 bits x 4 banks. It supports clock frequencies of 166 MHz and 143 MHz with a single 3.3V power supply. The device features an LVTTL interface, programmable burst lengths (1, 2, 4, 8, full page), and CAS latencies of 2 or 3 clocks. Available in 54-pin TSOP II and 60-ball fBGA packages, it operates within commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature ranges.

Memory IC Feature Summary

  • Fully synchronous operation with all signals referenced to the positive clock edge for high-speed data transfer via pipeline architecture.
  • Internal bank structure allows hiding row access and precharge times by interleaving operations across four independent banks.
  • Supports self-refresh modes and power-down modes to reduce power consumption during idle periods or system suspension.

Memory IC Applications

  • High-performance embedded systems requiring fast random-access memory
  • Digital signal processing (DSP) external memory interfaces
  • Consumer electronics utilizing 3.3V logic systems

Memory IC Procurement Notes

Verify package type availability, as the component is offered in both 54-pin TSOP II and 60-ball fBGA configurations. Confirm temperature grade requirements against specific project constraints. Check manufacturer documentation for current lifecycle status, as older revisions may be discontinued. Ensure compatibility with existing PCB footprints before ordering.

Memory IC Selection Notes

Select based on required operating temperature range and physical footprint constraints. The 16-bit data bus width suits applications needing wider data paths without increasing pin count excessively. Verify that the host controller supports the necessary LVTTL signaling levels and can handle the specified CAS latency options for optimal timing alignment.

Memory IC Part Context

This component belongs to ISSI's 64Mb SDRAM family, designed for general-purpose high-speed memory applications. It utilizes CMOS technology to achieve low power consumption while maintaining high throughput. The device integrates standard SDRAM control logic, including refresh controllers and mode registers, simplifying integration into complex digital designs.

Memory IC Replacement Considerations

Cross-reference with other ISSI 64Mb SDRAM parts like the IS42S16400E or IS42S16400N if package or temperature variations are needed. Ensure any substitute maintains identical pinout and electrical characteristics to avoid redesigning the memory interface circuitry.

Memory IC FAQ

How does the device manage power consumption during idle states?

The IS42S16400D includes power-down and self-refresh modes. Power-down reduces current when CKE is low, while self-refresh retains data internally without an external clock, allowing the rest of the system to power down.

What is the function of the A10 pin during read and write commands?

When A10 is HIGH during a READ or WRITE command, it enables the Auto Precharge feature. This causes the accessed row to be automatically precharged at the end of the burst sequence, freeing the bank for subsequent accesses.

IS42S16400D-7TIIS42S16400D-7TI
$2.96
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