Memory IC IS42S32400F-6TL product image

IS42S32400F-6TL

$3.12
  • Description:IC DRAM 128MBIT PAR 86TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray

SKU:0e4abda471d8 Category: Brand:

  
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IS42S32400F-6TL is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 128MBIT PAR 86TSOP II. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS42S32400F-6TL

  • Description:IC DRAM 128MBIT PAR 86TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM
  • Memory Size:128Mbit
  • Memory Organization:4M x 32
  • Memory Interface:Parallel
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:86-TFSOP (0.400", 10.16mm Width)
  • Supplier Device Package:86-TSOP II
  • Access Time:5.4 ns

Memory IC datasheet and documents for IS42S32400F-6TL

IS42S32400F-6TL

Memory IC Overview

The IS42S32400F-6TL is a 128Mb Synchronous DRAM organized as 4M x 32 bits across four internal banks. It operates at a maximum clock frequency of 166 MHz with an access time of 5.4 ns (CAS Latency 3). The device uses a single 3.3V power supply and features an LVTTL interface in an 86-pin TSOP-II package. Key electrical parameters include a minimum operating voltage of 3.0V, a maximum of 3.6V, and an operating temperature range of -40°C to +85°C for the industrial grade.

Memory IC Feature Summary

  • Supports fully synchronous operation with all signals referenced to the positive clock edge.
  • Includes internal bank architecture to hide row access and precharge times for seamless high-speed random access.
  • Features programmable burst lengths (1, 2, 4, 8, or full page) and selectable sequential or interleave burst sequences.
  • Provides auto-refresh and self-refresh modes to maintain data integrity while managing power consumption.

Memory IC Applications

  • High-speed data transfer systems requiring pipeline architecture
  • Industrial embedded memory solutions
  • Automotive electronic control units
  • Consumer electronics with strict thermal requirements

Memory IC Procurement Notes

Verify the specific suffix 'TL' against the manufacturer's official documentation to confirm the exact package type and temperature grade. Ensure that the ordering information matches the required automotive or industrial specifications. Confirm RoHS compliance status directly from the datasheet before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 128Mb capacity with a 32-bit data bus width is required. It is suitable for designs needing 166 MHz performance with low latency. Consider the 86-pin TSOP-II form factor for surface-mount applications where space constraints align with these dimensions.

Memory IC Part Context

This part belongs to the IS42S32400F family of SDRAMs manufactured by ISSI. It shares architectural similarities with other members like the IS45S32400F but differs in temperature ratings and refresh cycles. The device is designed for general-purpose high-density memory applications within the synchronous DRAM category.

Memory IC Replacement Considerations

Direct substitutes include the IS42S32400J-6TLI-TR and IS42S32400F-7BLI, provided they match the required package and temperature grade. Verify pin compatibility and timing parameters before substitution.

IS42S32400F-6TLIS42S32400F-6TL
$3.12
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