IS42SM16320E-75BLI-TR

Memory IC Overview

The IS42SM16320E-75BLI-TR is a mobile SDRAM component manufactured by ISSI, offering a total storage capacity of 512 Mbit. It features a data bus width of 16 bits and an organization of 32 M x 16. The device supports a maximum clock frequency of 133 MHz with an access time of 5.5 ns. Operating voltage ranges from 2.7 V to 3.6 V, while the maximum power supply current is 60 mA. It is housed in a 54-ball FBGA package measuring 8mm x 8mm, suitable for surface mount installation within an industrial temperature range of -40°C to +85°C.

Memory IC Feature Summary

• Mobile SDRAM architecture optimized for portable electronic applications
• High-speed parallel interface supporting up to 133 MHz operation
• Industrial-grade thermal stability for extended environmental reliability

Memory IC Applications

• Portable consumer electronics requiring compact memory solutions
• Embedded systems utilizing mobile dynamic random access memory
• Industrial control units operating within specified temperature limits

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm packaging type and moisture sensitivity level. Ensure compatibility with system voltage requirements ranging from 2.7 V to 3.6 V. Confirm that the 54-ball FBGA footprint matches the target PCB layout. Validate that the selected variant meets all necessary RoHS compliance standards for the intended market.

Memory IC Selection Notes

Select this component when a 512 Mbit density with a 16-bit interface is required for space-constrained designs. The 133 MHz speed class provides adequate performance for standard mobile applications. Consider the 54-ball FBGA package dimensions for board real estate constraints. Verify that the industrial temperature range aligns with the operational environment of the final product assembly.

Memory IC Part Context

This part belongs to the IS42SM16320E series of mobile SDRAM devices produced by ISSI. These components are designed to provide high-density memory storage in small form factors. The series typically includes various speed grades and organizational configurations to support diverse mobile computing needs while maintaining low power consumption profiles.

Memory IC Replacement Considerations

Consult official substitution guides for equivalent parts within the same family or alternative manufacturers offering compatible pinouts and electrical characteristics.