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IS43LD32128C-18BPLI-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 4GBIT HSUL 168VFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IS43LD32128C-18BPLI-TR
- Description：IC DRAM 4GBIT HSUL 168VFBGA
- Series：-
- Mfr：ISSI, Integrated Silicon Solution Inc
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：DRAM
- Technology：-
- Memory Size：4Gbit
- Memory Organization：128M x 32
- Memory Interface：HSUL_12
- Clock Frequency：533 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：168-VFBGA
- Supplier Device Package：168-VFBGA (12x12)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for IS43LD32128C-18BPLI-TR
Memory IC Overview
The IS43LD32128C-18BPLI-TR is a 4Gbit Low Power Double Data Rate Type 2 Synchronous Dynamic Random Access Memory (LPDDR2 SDRAM) manufactured by ISSI. It features an internal organization of 128M x 32 bits and supports data transfer rates up to 533 MHz. The device operates with dual voltage supplies: 1.2V for the core and 1.8V for I/O interfaces. It is housed in a 168-ball Package-on-Package (PoP) or Ball Grid Array (BGA) footprint measuring 12mm x 12mm, designed for high-density mobile applications requiring efficient power management.
Memory IC Feature Summary
- Supports LPDDR2-S4 interface standard for enhanced power efficiency
- Dual voltage operation with 1.2V core and 1.8V I/O levels
- High-speed data processing capability up to 533 MHz
- Compact 168-ball PoP/BGA package design for space-constrained devices
Memory IC Applications
- Mobile handheld devices
- Smartphones and tablets
- Portable consumer electronics
- Embedded systems requiring low-power memory
Memory IC Procurement Notes
Verify the specific suffix 'TR' indicates tape-and-reel packaging configuration when ordering. Confirm the exact package variant (PoP vs BGA) matches the target PCB layout, as physical dimensions may vary slightly between 12x12mm configurations. Ensure compatibility with the host controller's LPDDR2 signaling requirements and voltage domains before integration.
Memory IC Selection Notes
Select this component for designs prioritizing power efficiency over raw bandwidth. The 128M x 32 organization suits applications needing wide data paths with moderate density. Compare against automotive-grade variants if extended temperature ranges beyond industrial limits are required. Validate signal integrity constraints associated with the 168-ball package pitch.
Memory IC Part Context
This part belongs to ISSI's LPDDR2 DRAM family, which includes various densities and package options. It serves as a successor to earlier LPDDR generations, offering improved performance per watt. The series is widely used in portable electronics where battery life and form factor are critical design constraints.
Memory IC Replacement Considerations
IS43LD32128C-18BPLI is the non-tape-and-reel equivalent. IS46LD32128C-18BPLA2-TR is an automotive-grade alternative with similar specifications but different qualification standards.
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