Memory IC IS43LD32640C-25BLI-TR product image

IS43LD32640C-25BLI-TR

  • Description:IC DRAM 2GBIT PARALLEL 134TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)

SKU:4359c9cc8498 Category: Brand:

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IS43LD32640C-25BLI-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 2GBIT PARALLEL 134TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS43LD32640C-25BLI-TR

  • Description:IC DRAM 2GBIT PARALLEL 134TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR2-S4
  • Memory Size:2Gbit
  • Memory Organization:64M x 32
  • Memory Interface:HSUL_12
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.14V ~ 1.3V, 1.7V ~ 1.95V
  • Operating Temperature:-40°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:134-TFBGA
  • Supplier Device Package:134-TFBGA (10x11.5)
  • Access Time:5.5 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS43LD32640C-25BLI-TR

IS43LD32640C-25BLI-TR

Memory IC Overview

The IS43LD32640C-25BLI-TR is a Mobile LPDDR2 SDRAM component manufactured by ISSI. It provides a total storage capacity of 2 Gbit, organized as 64 Megawords by 32 bits. The device supports a maximum clock frequency of 400 MHz and operates within a supply voltage range of 1.2 V to 1.8 V. It utilizes a parallel interface and is housed in a 134-ball BGA package measuring 10 mm by 11.5 mm. The operational temperature range extends from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed data transfer with a maximum clock frequency of 400 MHz for efficient mobile processing.
  • Features low power consumption characteristics inherent to the Mobile LPDDR2 standard architecture.
  • Designed for surface-mount installation using a compact 134-ball BGA form factor.

Memory IC Applications

  • Mobile computing platforms requiring volatile memory
  • Smartphone and tablet system designs
  • Portable electronic devices utilizing LPDDR2 interfaces

Memory IC Procurement Notes

Verify the specific suffix and package variant against the manufacturer's current datasheet before integration. Confirm that the 134-ball BGA footprint matches the target PCB layout. Ensure the design accommodates the specified voltage levels and thermal requirements for the industrial temperature range.

Memory IC Selection Notes

Select this component when a 2 Gbit density with a 32-bit bus width is required for mobile applications. The 400 MHz speed grade suits high-performance portable systems. Verify compatibility with the host controller's LPDDR2 interface specifications and physical board space constraints.

Memory IC Part Context

This part belongs to the IS43LD series of Mobile LPDDR2 DRAMs from ISSI. It shares architectural similarities with other members like the IS43LD16640C but offers higher density and a wider data bus. The series is designed specifically for battery-powered mobile electronics requiring high bandwidth and low power.

Memory IC Replacement Considerations

Check for direct substitutes within the IS43LD family or equivalent offerings from other manufacturers. Ensure any replacement maintains the 134-ball BGA package and 400 MHz speed grade. Verify pin-to-pin compatibility and electrical parameter alignment.

IS43LD32640C-25BLI-TRIS43LD32640C-25BLI-TR

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