Memory IC IS43LQ32512A-046BLI product image

IS43LQ32512A-046BLI

$17.11
  • Description:16G, 1.06-1.17/1.70-1.95V, LPDDR
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray

SKU:b7117f5cfc7c Category: Brand:

  
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IS43LQ32512A-046BLI is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is 16G, 1.06-1.17/1.70-1.95V, LPDDR. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS43LQ32512A-046BLI

  • Description:16G, 1.06-1.17/1.70-1.95V, LPDDR
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4X
  • Memory Size:16Gbit
  • Memory Organization:1G x 16
  • Memory Interface:LVSTL
  • Clock Frequency:2.133 GHz
  • Write Cycle Time - Word, Page:18ns
  • Voltage - Supply:1.06V ~ 1.17V, 1.7V ~ 1.95V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:200-TFBGA
  • Supplier Device Package:200-TFBGA (10x14.5)
  • Access Time:3.5 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS43LQ32512A-046BLI

IS43LQ32512A-046BLI

Memory IC Overview

The IS43LQ32512A-046BLI is a mobile LPDDR4X SDRAM IC manufactured by ISSI. It features a total storage capacity of 16 Gb with an organization of 1G x 16. The device supports a maximum clock frequency of 2.133 GHz and has an access time of 3.5 ns. It operates within voltage ranges of 1.06V to 1.17V and 1.7V to 1.95V. The component is housed in a 200-TFBGA package measuring 10x14.5 mm and functions across a temperature range of -40°C to +95°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via LVSTL interface at frequencies up to 2.133 GHz
  • Operates with dual voltage domains for power efficiency
  • Designed for mobile applications requiring compact surface-mount packaging

Memory IC Applications

  • Mobile computing devices
  • Portable electronic systems
  • Embedded memory solutions

Memory IC Procurement Notes

Verify current availability status as supply constraints may affect order fulfillment. Confirm RoHS compliance and moisture sensitivity level requirements prior to integration. Ensure compatibility with existing board designs regarding the 200-TFBGA footprint and thermal specifications.

Memory IC Selection Notes

Select this component for designs requiring 16 Gb density in a small form factor. Verify that the host system supports LPDDR4X signaling standards and the specified voltage levels. Consider the operating temperature range to ensure reliability in the target environment.

Memory IC Part Context

This part belongs to the ISSI LPDDR4X mobile DRAM family, offering high bandwidth and low power consumption. It is designed to replace older generation memory solutions in space-constrained portable electronics while maintaining performance standards required by modern processors.

Memory IC Replacement Considerations

IS46LQ32512A-046BLA2 is listed as a parameter equivalent substitute.

IS43LQ32512A-046BLIIS43LQ32512A-046BLI
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