Memory IC IS43R83200D-5TL-TR product image

IS43R83200D-5TL-TR

$3.83
  • Description:IC DRAM 256MBIT PAR 66TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)

SKU:7b28f8d59c96 Category: Brand:

  
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IS43R83200D-5TL-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 256MBIT PAR 66TSOP II. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS43R83200D-5TL-TR

  • Description:IC DRAM 256MBIT PAR 66TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:2.3V ~ 2.7V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:66-TSSOP (0.400", 10.16mm Width)
  • Supplier Device Package:66-TSOP II
  • Access Time:700 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS43R83200D-5TL-TR

IS43R83200D-5TL-TR

Memory IC Overview

The IS43R83200D-5TL-TR is a 256Mbit DDR SDRAM manufactured by ISSI. It features a 32-bit data bus width and supports a maximum clock frequency of 200 MHz at CAS latency 3. The device operates within a voltage range of 2.3V to 2.7V for VDD and VDDQ. It utilizes a 144-ball BGA package with a 12mm x 12mm body size. The memory array is organized as 8M x 32 across four internal banks, providing concurrent operation capabilities.

Memory IC Feature Summary

  • Double-data rate architecture enabling two data transfers per clock cycle
  • Four internal banks allowing concurrent operations
  • SSTL_2 compatible I/O interface
  • Supports Auto Refresh and Self Refresh modes

Memory IC Applications

  • High-speed data transfer systems
  • Pipeline architecture applications
  • Concurrent bank operation environments

Memory IC Procurement Notes

Verify the specific speed grade -5 against system requirements, ensuring compatibility with the 200 MHz maximum clock frequency at CAS latency 3. Confirm the 144-ball BGA package dimensions match the PCB footprint. Check that the operating temperature range aligns with the intended commercial or industrial environment specifications.

Memory IC Selection Notes

Select this component when a 32-bit data bus width is required for high-bandwidth applications. Ensure the design supports the 2.5V nominal supply voltage and SSTL_2 signaling standards. Consider the 144-ball BGA package constraints during layout planning. Verify that the controller can handle the initialization sequence and mode register settings defined in the datasheet.

Memory IC Part Context

This part belongs to the IS43R83200D series from ISSI, which includes variants with different configurations such as 16Mx16 and 32Mx8. The series offers multiple package options including TSOP-II and FBGA. The -5 suffix indicates the speed grade, while the TR suffix denotes tape and reel packaging for automated assembly processes.

Memory IC Replacement Considerations

Check for other ISSI parts within the IS43R83200D family that may offer alternative package types or speed grades. Verify pinout compatibility if substituting with similar DDR SDRAM devices from other manufacturers.

IS43R83200D-5TL-TRIS43R83200D-5TL-TR
$3.83
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