Memory IC IS43R83200F-6TL product image

IS43R83200F-6TL

$2.27
  • Description:IC DRAM 256MBIT PAR 66TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tube

SKU:1d98332def02 Category: Brand:

  
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IS43R83200F-6TL is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 256MBIT PAR 66TSOP II. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS43R83200F-6TL

  • Description:IC DRAM 256MBIT PAR 66TSOP II
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tube
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:Parallel
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:2.3V ~ 2.7V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:66-TSSOP (0.400", 10.16mm Width)
  • Supplier Device Package:66-TSOP II
  • Access Time:700 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS43R83200F-6TL

IS43R83200F-6TL

Memory IC Overview

The IS43R83200F-6TL is a 256 Mbit DDR SDRAM manufactured by ISSI. It features a 32M x 8 organization and operates at a maximum clock frequency of 166 MHz with a 6 ns access time. The device utilizes a standard 2.5V supply voltage, ranging from 2.3V to 2.7V. It is housed in a 66-pin TSOP-II package (400 mil) designed for surface mount technology. The component supports industrial temperature ranges from -40°C to +85°C and includes humidity sensitivity features.

Memory IC Feature Summary

  • Supports Double Data Rate synchronous dynamic random access memory architecture
  • Includes four internal banks with independent bank controls
  • Features programmable burst lengths and CAS latency options
  • Provides auto-refresh and self-refresh power management modes

Memory IC Applications

  • Consumer electronics requiring compact memory solutions
  • Industrial control systems operating in wide temperature environments
  • Embedded computing platforms utilizing surface mount assembly

Memory IC Procurement Notes

Verify the specific suffix against official datasheets to confirm package dimensions and temperature ratings. Confirm RoHS compliance status and moisture sensitivity levels prior to procurement. Ensure ordering quantities align with manufacturer packaging constraints. Validate that the intended application environment matches the specified industrial temperature range requirements.

Memory IC Selection Notes

Select this component when a 256 Mbit capacity with an 8-bit data bus width is required. Choose this part for designs necessitating a 66-pin TSOP-II footprint. Consider this option for applications demanding operation within the -40°C to +85°C range. Verify compatibility with 2.5V logic levels and SSTL_2 input standards.

Memory IC Part Context

This device belongs to the IS43R83200F series of DDR SDRAM products from ISSI. It shares architectural similarities with other members of the family but differs in specific speed grades and packaging configurations. The series provides scalable memory solutions for various embedded applications requiring reliable data storage.

Memory IC Replacement Considerations

The IS43R83200D-6TLI serves as a verified alternative within the same product family. Both parts share identical electrical specifications and pinouts. Verify that the replacement variant meets all environmental and packaging requirements for the target design.

IS43R83200F-6TLIS43R83200F-6TL
$2.27
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