Memory IC IS43TR16640B-125KBL-TR product image

IS43TR16640B-125KBL-TR

  • Description:IC DRAM 1GBIT PARALLEL 96TWBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)

SKU:b8cac3adc5ee Category: Brand:

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IS43TR16640B-125KBL-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 1GBIT PARALLEL 96TWBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS43TR16640B-125KBL-TR

  • Description:IC DRAM 1GBIT PARALLEL 96TWBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3
  • Memory Size:1Gbit
  • Memory Organization:64M x 16
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-TFBGA
  • Supplier Device Package:96-TWBGA (9x13)
  • Access Time:20 ns
  • Grade:Automotive
  • Qualification:AEC-Q100

Memory IC datasheet and documents for IS43TR16640B-125KBL-TR

IS43TR16640B-125KBL-TR

Memory IC Overview

The ISSI IS43TR16640B-125KBL-TR is a 1Gb DDR3 SDRAM organized as 64Mx16. It operates at standard voltage (1.5V) or low voltage (1.35V). The device supports data transfer rates up to 1600MT/s with a system frequency of 800MHz. It features an 8n-bit pre-fetch architecture and eight internal banks for concurrent operation. The component is housed in a 96-ball BGA package measuring 9mm x 13mm.

Memory IC Feature Summary

  • Supports both standard 1.5V and low voltage 1.35V operation with backward compatibility.
  • Features eight internal banks enabling concurrent operations within the memory array.
  • Includes programmable CAS latency, additive latency, and burst length settings.
  • Provides dynamic on-die termination and off-chip driver impedance adjustment capabilities.

Memory IC Applications

  • High-speed data buffering in computing systems
  • Graphics memory applications requiring high bandwidth
  • Embedded systems utilizing DDR3 interface standards

Memory IC Procurement Notes

Verify the specific speed bin designation matches the required timing parameters for your system design. Confirm that the 96-ball BGA footprint aligns with your PCB layout constraints. Ensure power supply sequencing adheres to the initialization sequence outlined in the datasheet to prevent operational faults during startup.

Memory IC Selection Notes

Select this component when a 16-bit data bus width is required for the target application. Consider the 1.35V option if power efficiency is a priority, noting its compatibility with 1.5V systems. Verify that the operating temperature range meets the environmental requirements of the final assembly.

Memory IC Part Context

This part belongs to the IS43TR16640B series of DDR3 SDRAMs manufactured by ISSI. It is designed for high-performance memory applications requiring reliable data storage and retrieval. The series includes various speed bins and voltage options to suit different system architectures and performance needs.

Memory IC Replacement Considerations

Check for compatible parts within the same ISSI DDR3 family that share the 64Mx16 organization and 96-ball BGA package. Ensure any substitute supports the same voltage levels and speed grades to maintain electrical compatibility.

IS43TR16640B-125KBL-TRIS43TR16640B-125KBL-TR

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