Memory IC IS43TR82560BL-125KBLI-TR product image

IS43TR82560BL-125KBLI-TR

  • Description:IC DRAM 2GBIT PARALLEL 78TWBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)

SKU:61883a33a641 Category: Brand:

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IS43TR82560BL-125KBLI-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 2GBIT PARALLEL 78TWBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS43TR82560BL-125KBLI-TR

  • Description:IC DRAM 2GBIT PARALLEL 78TWBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-TWBGA (8x10.5)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS43TR82560BL-125KBLI-TR

IS43TR82560BL-125KBLI-TR

Memory IC Overview

The IS43TR82560BL-125KBLI-TR is a 2Gb DDR3 SDRAM manufactured by ISSI. It features a 256Mx8 organization and operates at a standard voltage of 1.5V ± 0.075V or low voltage of 1.35V (+0.1V/-0.067V). The device supports data transfer rates up to 1600MT/s with a speed bin of 125K (DDR3-1600K) and timings of 11-11-11. It utilizes a 78-ball BGA package measuring 8mm x 10.5mm.

Memory IC Feature Summary

  • Supports high-speed data transfer rates with system frequencies up to 1066 MHz.
  • Features an 8n-bit pre-fetch architecture with 8 internal banks for concurrent operation.
  • Includes programmable CAS latency, additive latency, and burst length options.
  • Provides dynamic on-die termination and off-chip driver impedance adjustment capabilities.

Memory IC Applications

  • High-performance computing systems
  • Telecommunications infrastructure equipment
  • Industrial control applications

Memory IC Procurement Notes

Verify the specific speed bin and voltage requirements against the target system design before procurement. Confirm that the 78-ball BGA footprint matches the PCB layout. Ensure the ordering suffix corresponds to the required tape and reel packaging format for automated assembly processes.

Memory IC Selection Notes

Select this component when a 2Gb density with an 8-bit data bus width is required. Consider the 125K speed bin for systems needing 1600MT/s throughput. Evaluate the operating temperature range to ensure compatibility with commercial or industrial environmental conditions.

Memory IC Part Context

This part belongs to the IS43/46TR82560B/L series from ISSI. It is designed as a high-density synchronous dynamic random access memory. The series supports both standard and low-voltage operations, offering flexibility for various power-constrained and performance-oriented electronic designs.

Memory IC Replacement Considerations

Check for compatible parts within the same ISSI family with different speed bins or voltage ratings. Verify pin-to-pin compatibility with other 78-ball BGA DDR3 devices if cross-referencing with alternative manufacturers.

Memory IC FAQ

Is TDQS supported in this device?

Yes, Termination Data Strobe (TDQS) is supported for the x8 configuration of this device.

What is the maximum system frequency?

The device supports high-speed data transfer rates with a system frequency up to 1066 MHz.

IS43TR82560BL-125KBLI-TRIS43TR82560BL-125KBLI-TR

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