Memory IC IS43TR85120AL-15HBLI-TR product image

IS43TR85120AL-15HBLI-TR

$10.76
  • Description:IC DRAM 4GBIT PAR 78TWBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)

SKU:d8491fc56416 Category: Brand:

  
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IS43TR85120AL-15HBLI-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 4GBIT PAR 78TWBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS43TR85120AL-15HBLI-TR

  • Description:IC DRAM 4GBIT PAR 78TWBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:4Gbit
  • Memory Organization:512M x 8
  • Memory Interface:Parallel
  • Clock Frequency:667 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-TWBGA (9x10.5)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS43TR85120AL-15HBLI-TR

IS43TR85120AL-15HBLI-TR

Memory IC Overview

The IS43TR85120AL-15HBLI-TR is a 4 Gbit DDR3 SDRAM component manufactured by ISSI. It features an organization of 512 M x 8 and operates with a data bus width of 8 bits. The device supports standard voltage (1.5V ± 0.075V) and low voltage (1.35V +0.1/-0.067V) configurations, ensuring backward compatibility. It achieves high-speed data transfer rates up to 1333 MT/s (DDR3-1333H speed bin). The memory is housed in a 78-ball BGA package measuring 9mm x 10.5mm. It includes programmable CAS latency, additive latency, burst length, and dynamic on-die termination.

Memory IC Feature Summary

  • Supports both standard 1.5V and low-voltage 1.35V operation for flexible power management.
  • Features eight internal banks allowing concurrent operations and an 8n-bit pre-fetch architecture.
  • Includes programmable parameters such as CAS latency, additive latency, and burst length.
  • Integrates dynamic on-die termination and write leveling capabilities.

Memory IC Applications

  • High-performance computing systems requiring fast data access
  • Embedded solutions utilizing DDR3 memory interfaces
  • Industrial applications operating within specified temperature ranges

Memory IC Procurement Notes

Verify the specific ordering suffix 'I' corresponds to the industrial temperature range (-40°C to +95°C) as defined in the manufacturer's documentation. Confirm that the '-TR' suffix indicates tape-and-reel packaging if required for automated assembly. Ensure the source document explicitly links these suffixes to the electrical and thermal specifications before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 4 Gbit capacity with an 8-bit data bus width is required. It is suitable for designs needing support for both 1.5V and 1.35V supply rails. The 78-ball BGA package is appropriate for space-constrained PCB layouts. Verify that the system controller supports the necessary DDR3 initialization sequence and mode register settings.

Memory IC Part Context

This part belongs to the IS43TR85120AL series of DDR3 SDRAMs from ISSI. It shares architectural similarities with other devices in the IS43/46TR family but differs in density and bus width. The datasheet covers multiple variants including x8 and x16 configurations, with this specific model representing the 512Mx8 organization.

Memory IC Replacement Considerations

Check for other ISSI parts within the IS43TR85120AL series that match the required speed bin and package type. Verify compatibility with existing board layouts and signal integrity requirements when substituting with similar density DRAM components.

IS43TR85120AL-15HBLI-TRIS43TR85120AL-15HBLI-TR
$10.76
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