IS5SM

Overview

The IS5SM is a surface-mount phototransistor optocoupler from Isocom Components, part of the IS* series. It integrates an infrared LED with an NPN silicon phototransistor in a space-efficient dual-in-line plastic package. Key electrical specifications include a high isolation voltage of 5.3 kVrms and 7.5 kV peak, with a minimum collector-emitter breakdown voltage (BVCEO) of 70 V. The device supports DC input current and provides galvanic isolation for signal transmission between systems of differing potentials.

Feature Summary

• Integrates an infrared light emitting diode and an NPN silicon phototransistor within a single compact unit
• Provides high electrical isolation capability suitable for separating circuits with different potential levels
• Features a surface-mount configuration designed for efficient board space utilization
• Ensures reliable signal transmission across varying impedance environments

Applications

• Computer terminals
• Industrial system controllers
• Signal transmission between systems of different potentials and impedances

Procurement Notes

Verify that the specific ordering suffix 'SM' corresponds to the surface-mount package variant as defined by the manufacturer's official documentation. Confirm that the component meets the required isolation voltage ratings and BVCEO specifications for the target application environment. Ensure compliance with relevant safety approvals such as UL or VDE if applicable to the end product design requirements.

Selection Notes

Select the IS5SM when a surface-mount phototransistor isolator is required with high isolation voltage capabilities. This component is appropriate for applications demanding compact packaging while maintaining robust signal integrity between isolated circuits. Consider the 70 V minimum breakdown voltage and 5.3 kVrms isolation rating when designing for high-potential separation scenarios.

Part Context

The IS5SM belongs to the IS*, ISD*, and ISQ* series of high-density phototransistor optically coupled isolators manufactured by Isocom Components. These devices are characterized by their integration of infrared LEDs and NPN silicon phototransistors in dual-in-line plastic packages. The series offers various lead form options, including standard through-hole and surface-mount configurations, to accommodate diverse assembly needs.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source data.