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IS608XSMT&R is listed in the Triac, SCR Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLATOR 5.3KV TRIAC 1CH. Review the specifications below when checking this part for your BOM.
The IS608XSMT&R is a surface mount optocoupler manufactured by Isocom Components 2004 LTD. It features a single channel with a triac output device, housed in a 6-pin DIP package. The component provides an isolation voltage of 5.3 kVrms and supports a maximum forward current of 50 mA. Designed for DC input applications, it utilizes a bilateral random phase triac to control AC loads. The device operates within a standard temperature range and offers high isolation capabilities suitable for industrial environments.
Verify the specific suffix 'SMT&R' confirms the tape and reel packaging format required for your manufacturing line. Ensure the supplier source is authorized to guarantee component authenticity and traceability. Cross-reference the manufacturer part number against official Isocom documentation to confirm current production status and availability before finalizing procurement orders.
Select this component when a random phase triac output is required for AC switching applications. The 5.3 kVrms isolation rating makes it suitable for high-voltage isolation barriers. Consider the surface mount DIP footprint for PCB space constraints. Verify that the 50 mA forward current capability meets the LED drive requirements of the target circuit design.
Isocom Components specializes in providing alternative sources for discontinued or hard-to-find optoelectronic devices. The IS608XSMT&R belongs to their portfolio of surface mount optocouplers designed to replace legacy components. This series focuses on delivering reliable isolation solutions for industrial and commercial electronics using established semiconductor technologies.
Check datasheets for equivalent models from other manufacturers offering similar random phase triac outputs. Verify pinout compatibility and physical dimensions to ensure direct replacement feasibility without PCB redesign.
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