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IS61LPS12836EC-200B3I is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC SRAM 4MBIT PARALLEL 165TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for IS61LPS12836EC-200B3I
- Description：IC SRAM 4MBIT PARALLEL 165TFBGA
- Series：-
- Mfr：ISSI, Integrated Silicon Solution Inc
- Package：Tray
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM - Synchronous, SDR
- Memory Size：4Mbit
- Memory Organization：128K x 36
- Memory Interface：Parallel
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：3.135V ~ 3.465V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：165-TBGA
- Supplier Device Package：165-TFBGA (13x15)
- Access Time：3.1 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for IS61LPS12836EC-200B3I
Memory IC Overview
The IS61LPS12836EC-200B3I is a 4 Mbit Synchronous Pipelined Static Random Access Memory (SRAM) manufactured by ISSI. It features a memory organization of 128K x 36 and supports a maximum clock frequency of 200 MHz with an access time of 3.1 ns. The device operates within a voltage range of 3.135 V to 3.465 V, drawing a maximum current of 210 mA. It utilizes a parallel interface and is housed in a 165-ball FBGA package suitable for surface mount technology. The component is rated for industrial temperatures between -40°C and +85°C.
Memory IC Feature Summary
- Supports synchronous pipelined architecture with single-cycle deselect capability
- Integrates Error Correction Code (ECC) logic for data integrity
- Provides 36-bit wide data output per access cycle
Memory IC Applications
- High-speed networking equipment requiring low-latency buffering
- Telecommunications infrastructure systems
- Industrial control applications demanding reliable data storage
Memory IC Procurement Notes
Verify the specific suffix 'B3I' against official ISSI documentation to confirm pinout and electrical characteristics, as distributor listings may vary. Ensure compatibility with 3.3V I/O requirements and FBGA-165 footprint constraints during procurement planning.
Memory IC Selection Notes
Select this component when a 36-bit data width is required for high-performance processing. The 200 MHz speed and ECC support make it suitable for error-sensitive environments. Confirm that the 165-ball BGA package fits the target PCB layout and thermal design specifications.
Memory IC Part Context
This part belongs to the IS61LPS12836EC series of synchronous SRAMs. It shares architectural similarities with other members like the IS61LPS12836A but offers specific performance optimizations. The EC variant typically denotes enhanced features or packaging options within the broader ISSI memory portfolio.
Memory IC Replacement Considerations
The IS61LPS12836EC-200B3LI-TR is a documented alternative offering identical electrical specifications and functionality. Verify package compatibility and lead-free status before substitution.
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